ACHIEVEMENT
| 번호 | 제목 | 권(호) | 쪽 | 출판년도 |
|---|---|---|---|---|
| 246 |
Nano ConvergenceAdvanced WBG Power Semiconductor Packaging: Nanomaterials and Nanotechnologies for High-Performance Die Attach PasteYoung-Min Ju, Tae-Wan Kim, Seung-Hyun Lee, Jinho Ahn and Hak-Sung Kim |
12(38) | 2025-07-23 | |
| 245 |
ADVANCED MATERIALS TECHNOLOGIESAdvanced Optical Integration Processes for Photonic-Integrated Circuit PackagingKeuntae Baek, Minhyeok Kim, Hak-Sung Kim, Jinho Ahn, and Hongyun So |
10(19) | e01848 | 2025-06-25 |
| 244 |
Transactions on Components, Packaging and Manufacturing TechnologyDetermination of Fatigue Model Constants for Bi-Based SAC305 Hybrid Solder JointYongrae Jang, You-Gwon Kim, Hak-Sung Kim, Do-Hyung Kim, Dong-Min Jang, Jin-Woo Jang, Seung-Yeong Lee, and Bongtae Han |
15(10) | 2152-2159 | 2025-06-13 |
| 243 |
ACS Applied Materials & InterfacesUltra milli-second flip-chip bonding process via intense pulsed light irradiationYoung-Min Ju, Seong-Ung Ryu, Jong-Whi Park, and Hak-Sung Kim |
17 (27) | 39694–39707 | 2025-06-09 |
| 242 |
Applied Surface Science AdvancesMeasurement of interfacial adhesion strength of Copper-Silicon based dielectric interfaces via laser spallation testYoung-Min Ju, Dukyong Kim, Se-Min Lee, Heuisu Kim, Daewoong Lee, Yeontaek Hwang, Seung Hwan Lee and Hak-Sung Kim |
28 | 100783 | 2025-06-07 |