ACHIEVEMENT
| 번호 | 제목 | 개최일 |
|---|---|---|
| 480 |
2026 IEEE 76th Electronic Components and Technology Conference (ECTC)Reliability Evaluation of Intense Pulsed Light Flip-Chip Bonding with Various Surface FinishesHyeong-Bin Park, Young-Min Ju, Yun-Joong Kim and Hak-Sung kim |
2026.05 |
| 479 |
2026 IEEE 76th Electronic Components and Technology Conference (ECTC)Reliability Prediction of Automotive SiC MOSFET Packages Based on Degradation of EMC Viscoelasticity and Interfacial StrengthSe-Min Lee, Se-Jun Park, Hee-Ju Han, Hyun-Woo Jung, Kyung-Woo Lee, Dae-Un Sung, Hongyun So and Hak-Sung Kim |
2026.05 |
| 478 |
2026 IEEE 76th Electronic Components and Technology Conference (ECTC)FEA-Integrated 3PB and BOR Testing for Fracture Strength Characterization of Ultrathin Dies: Effects of Thickness, Surface Conditions, and AnisotropyJun-Seop Song, Sang-Il Kim, Gyu-Won Kim Woong-Kyoo Yoo, Jong-Woon Yoo , Sang-Hoon Ko, and Hak-Sung Kim |
2026.05 |
| 477 |
2026 IEEE 76th Electronic Components and Technology Conference (ECTC)Warpage Prediction of PCB in Multi-Laminating Processes Considering Cure Shrinkage and Anisotropic Visco-Elastic Properties of Prepreg CoreSanjay Kumar, Woong-Kyoo Yoo, Jaesung Kim, Chae-Young Ahn, Chan Hyuk Park, Jinwoong Kim, Hyung-mo Koo and Hak-Sung Kim |
2026.05 |
| 476 |
2026 IEEE 76th Electronic Components and Technology Conference (ECTC)Simplified Fluxless Bonding via Ultraviolet Activation: Enabling High-Reliability Fine-Pitch InterconnectsYou-Gwon Kim, Dong-Hoon Yoo, Hyeong-Bin Park, Jong-Whi Park, Seungchul Shin, Dongsuk Kang, and Hak-Sung Kim |
2026.05 |