ACHIEVEMENT
| 번호 | 제목 | 개최일 |
|---|---|---|
| 508 |
2026 대한기계학회 재료 및 파괴부문 춘계학술대회Influence of Anisotropic Thermo-Viscoelastic Behavior of Woven Prepregs on Warpage in Ultra-Thin PCB SubstratesSanjay Kumar, Woong-Kyoo Yoo, Jaesung Kim, Chae-Young Ahn, Dong Gun Cho, Jinwoong Kim, Hak-Sung Kim |
2026.06 |
| 507 |
2026 대한기계학회 재료 및 파괴부문 춘계학술대회Prediction of thermal bridge of building structures based on physics-informed neural networks with universal structure modelGyu-Won Kim, Sang-Il Kim, Se-Min Lee, Hak-Sung Kim |
2026.06 |
| 506 |
2026 대한기계학회 재료 및 파괴부문 춘계학술대회Intrinsic critical energy release rate assessment of intermetallic compound in SAC 305 solder joint using Fully-IMC specimenNa-Young Kim, Dong-Hoon Yoo and Hak-Sung Kim |
2026.06 |
| 505 |
2026 대한기계학회 재료 및 파괴부문 춘계학술대회Advancing Solder Joint Reliability with Bi–Ni–Pd Modified SAC Alloys: Insights into Creep Behavior, Interfacial Stability, and Joint StrengthYou-Gwon Kim, Hyeong-Bin Park, Dong-Hoon Yoo, Hak-Sung Kim |
2026.06 |
| 504 |
2026 대한기계학회 재료 및 파괴부문 춘계학술대회Enhanced reliability of Bimodal Copper Ink-filled TGVs via Step controlled Densification in Glass InterposersYun-Joong Kim, Hee-Ju Han, Yi-Hyun Kim, Hak-Sung Kim |
2026.06 |