ACHIEVEMENT
| 번호 | 제목 | 개최일 |
|---|---|---|
| 488 |
2026 대한기계학회 재료 및 파괴부문 춘계학술대회Quantification of Creep Behavior Through Microstructural Analysis of SAC305 SolderJei Jang, You-Kwon Kim, Hak-Sung Kim |
2026.06 |
| 487 |
2026 대한기계학회 재료 및 파괴부문 춘계학술대회Simultaneous evaluation of battery separator thickness and porosity using band-pass filtered terahertz wave signalMin-Woo Jeon, Sang-Il Kim, Heon-Su Kim, Tae-Wan Kim, Hak-Sung Kim |
2026.06 |
| 486 |
2026 대한기계학회 재료 및 파괴부문 춘계학술대회Ultrafast Intense Pulsed Light Bonding for Advanced Semiconductor PackagingYoung-Min Ju, Hyeong-Bin Park, Yun-Joong Kim, Hak-Sung Kim |
2026.06 |
| 485 |
2026 대한기계학회 재료 및 파괴부문 춘계학술대회Analysis of High-Temperature Storage Degradation Behavior in Glass Substrate-Based CPW Structures with Different Interconnect GeometriesHee-Ju Han, Yun-Joong Kim, Hak-Sung Kim |
2026.06 |
| 484 |
2026 대한기계학회 재료 및 파괴부문 춘계학술대회Effect of Material Degradation of EMC on Package Stress of Automotive High Voltage SiC MOSFET Power Semiconductor DeviceHyun-Woo Jung, Kyung-Woo Lee, Dae-Un Sung, Se-Min Lee, Hak-Sung Kim |
2026.06 |