ACHIEVEMENT
| 번호 | 제목 | 권(호) | 쪽 | 출판년도 |
|---|---|---|---|---|
| 253 |
Materials & DesignEffect of electroplating current density and post-annealing on the warpage and reliability of redistributed layer for advanced semiconductor packageTaek-Hyeon Kim, Jeong-Hyeon Baek, Sang-Il Kim, Tae-Hoon Kim, Ji-Hye Shim and Hak-Sung Kim |
(Submitted) | 99999.99.99 | |
| 252 |
Composite Part BIntegrated Design and Validation of a 3D Radiant Heater for Electrical Vehicles: Thermo-Electrical Finite Element Analysis Considering Strain-Dependent Resistance in Thermo-Forming ProcessJeong-Hyeon Baek, Tae-In Park, Yoon-Jin Kim, Ji-Sun Park and Hak-Sung Kim |
(Submitted) | 99999.99.99 | |
| 251 |
Materials & DesignNon-destructive evaluation of PET thermal degradation using terahertz time domain spectroscopyTae-Wan Kim, Sang-Il Kim, Hyun-Jin Jung, Heon-Su Kim, Chang-Jin Moon and Hak-Sung Kim |
(Submitted) | 9999.99.99 | |
| 250 |
Archive of Compututational Methods in EngineeringFast warpage prediction of printed circuit board with the automatically classified copper patterns for anisotropic viscoelastic homogenizationWoong-Kyoo Yoo,Jeong-Hyeon Baek,Jong-Whi Park,Hak-Sung Kim |
(Submitted) | 9999.99.99 | |
| 249 |
MeasurementIn-situ inspection of stealth laser diced internal crack lines in silicon wafer using cepstrum signal processing with terahertz electromagnetic wavesSang-Il Kim†, Heon-Su Kim†, Tae-Wan Kim, Jin-Sang Lim, Dong-Su Han, Hae-Gu Lee, and Hak-Sung Kim |
(Sumitted) | 9999.99.99 |