ACHIEVEMENT
| 번호 | 제목 | 권(호) | 쪽 | 출판년도 |
|---|---|---|---|---|
| 237 |
Journal of Materials Processing TechnologyMulti-Physics Coupled Modeling of Process-Induced Warpage in Advanced Fan-Out Wafer-Level Semiconductor PackagesJeong-Hyeon Baek, Jun-Seop Song, Woong-Kyoo Yoo, Woo-Jin An , Gyung-Hwan Oh, and Hak-Sung Kim |
(Submitted) | 9999.99.99 | |
| 236 |
Composites Part B: EngineeringProcess-integrated in-situ characterization and multiscale modeling of cure-dependent thermo-mechanical behavior of highly silica filled epoxy composites for accurate warpage prediction in advanced semiconductor packagingJeong-Hyeon Baek, Woong-Kyoo Yoo, Woo-Jin An, Jun-Seop Song, Gyung-Hwan Oh, Ji-Hye Shim, and Hak-Sung Kim |
(Submitted) | 9999.99.99 | |
| 235 |
Applied Surface ScienceDry Plasma-Enhanced Adhesion of Ti/Cu Seed Layers to ABF Substrates for Fine-Pitch Packaging ReliabilitySe-Min Lee, Hui-Jin Um, Na-Hyun Jeon, Hyun-Ji Rho, Soon-Oh Jeong, Young-Ju Han , Moo-Seong Kim and Hak-Sung Kim |
(Submitted) | 9999.99.99 | |
| 234 |
Engineering Applications of Artificial IntelligenceDeep Neural Network Methodology for Predicting and Visualizing Passenger Airbag Deployment Dynamics: Toward Industrial ImplementationGyu-Won Kim, Se-Min Lee, Hyun-Ji Rho, Jae-Hyun An and Hak-Sung Kim |
(Submitted) | 9999.99.99 | |
| 233 |
Mechanical Systems and Signal ProcessingSurrogate-assisted design optimization of an automotive cowl crossbar for NVH performance using a DNN–GA frameworkSeung-Hyun Lee,Se-Min Lee,Gyu-Won Kim,Jae-Hyun Ahn,Hak-sung Kim |
(Submitted) | 9999.99.99 |