About Us
In this laboratory, we perform a multi-disciplinary research on a variety of topics, such as printed electronics, semiconductor packaging, reliability studies, energy storage research body, the functinal composites
LAB NEWS
융합기계공학과 첨단 반도체패키징 혁신(APIL) 연구실 김학성 교수님 Elsevier 선정 ‘세계 상위 2% 연구자’ 2개 부문 동시 선정
2026-02-18
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[전자신문] 융합기계공학과 첨단 반도체패키징 혁신(APIL) 연구실 김학성 교수님 한국마이크로전자 및 패키징학회 제정 해동젊은공학인상 수상
2026-01-19
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- · 융합기계공학과 APIL 연구실 김상일 박사 박사학위 우수 논문상 수상 2026-03-02
- · 융합기계공학과 첨단 반도체패키징 혁신(APIL) 연구실 김학성 교수님 Elsevier 선정 ‘세계 상위 2% 연구자’ 2개 부문 동시 선정 2026-02-18
- · 융합기계공학과 첨단 반도체패키징 혁신(APIL) 연구실 김태완 박사과정 연구원 한국비파괴검사학회 우수논문발표상 수상 2026-01-28
PHOTOS
Research Areas
Printed electronics
Printed electronics is electronic device or electronics made by using printing methods.
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Structural Composites
The mechanical components need to have light weight and high strength
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Nondestructive Evaluation with THz
Terahertz waves can be used for Non-Destructive Evaluation in manufacturing, quality control, and process monitoring.
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Semiconductor packaging technology
Market occupation of high density memory products such as smart phone and tablet PD is increasing rapidly.
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