About Us
In this laboratory, we perform a multi-disciplinary research on a variety of topics, such as printed electronics, semiconductor packaging, reliability studies, energy storage research body, the functinal composites
LAB NEWS
융합기계공학과 첨단 반도체패키징 혁신(APIL) 연구실 김유권 박사과정, 유동훈 석박통합과정 ECTC 2026 'Student Travel Grant' 수상
2026-06-08
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- · 한양대 김학성 교수팀, 세계 최고 반도체 패키징 학회 ‘ECTC 2026’서 3관왕 쾌거 2026-06-15
- · 노피온, 한양대와 공동연구 ECTC 2026 하이라이트 논문 선정 2026-06-09
- · 융합기계공학과 첨단 반도체패키징 혁신(APIL) 연구실 김유권 박사과정, 유동훈 석박통합과정 ECTC 2026 'Student Travel Grant' 수상 2026-06-08
PHOTOS
Research Areas
Printed electronics
Printed electronics is electronic device or electronics made by using printing methods.
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Structural Composites
The mechanical components need to have light weight and high strength
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Nondestructive Evaluation with THz
Terahertz waves can be used for Non-Destructive Evaluation in manufacturing, quality control, and process monitoring.
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Semiconductor packaging technology
Market occupation of high density memory products such as smart phone and tablet PD is increasing rapidly.
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