ACHIEVEMENT
| 번호 | 제목 | 권(호) | 쪽 | 출판년도 |
|---|---|---|---|---|
| 269 |
Composites CommunicationsProcess-History-Dependent Warpage Evolution in Advanced Semiconductor Substrates Role of Cu-Clad LaminateWoong-Kyoo Yoo, Sanjay Kumar, Jaesung Kim, Chaeyoung Ahn, Jinwoong Kim, Chan-Hyuk Park, and Hak-Sung Kim |
(Submitted) | 9999.99.99 | |
| 268 |
Corrosion ScienceCorrosion lifetime prediction of electro-galvanized iron using potentiodynamic polarization and multiphysics simulation under different process and environmental conditionsSe-Jun Park, Ho-Jin Lee, Sang-Il Kim, Kwang-Soon Kim, Jae-Seok Choi, Gab-Seong Lee, and Hak-Sung Kim |
(Submitted) | 9999.99.99 | |
| 267 |
Materials CharacterizationFEA-integrated 3PB and BOR testing for accurate fracture strength evaluation of ultra-thin dies: effects of thickness and process conditionsJun-Seop Song, Sang-Il Kim, Gyu-Won Kim, Woong-Kyoo Yoo, Jong-Woon Yoo, Sang-Hoon Ko, and Hak-Sung Kim |
(Submitted) | 9999.99.99 | |
| 266 |
Materials & DesignUltrafast Intense Pulsed Light Bonding Process for Multi-die Stacked PackagesYoung-Min Ju, Hyeong-Bin Park, Yun-Joong Kim, and Hak-Sung Kim |
(Submitted) | 9999.99.99 | |
| 265 |
Applied Surface ScienceDecoupling PEG and chloride co-adsorption kinetics at copper/electrolyte interface during pattern-dependent electrodepositionSangmin Cho, Jeongwoo Park, Sangmin Park, Yulim Seol, Jihye Shim, HakSung Kim, Hongyun So |
746 | 167516 | 2026.11.15 |