ACHIEVEMENT
| 번호 | 제목 | 권(호) | 쪽 | 출판년도 |
|---|---|---|---|---|
| 259 |
Materials Today AdvancesProcess-integrated in-situ characterization and multiscale modeling of cure-dependent thermo-mechanical behavior of highly silica filled epoxy composites for accurate warpage prediction in advanced semiconductor packagingJeong-Hyeon Baek, Woong-Kyoo Yoo, Woo-Jin An, Jun-Seop Song, Gyung-Hwan Oh, Ji-Hye Shim, and Hak-Sung Kim |
30 | 100781 | 2026.06.01 |
| 258 |
Composites Part ARapid PCB Warpage Modeling Through Automated Copper Pattern Classification and Classical Lamination Theory–Driven Anisotropic Viscoelastic HomogenizationWoong-Kyoo Yoo, Jeong-Hyeon Baek, Jong-Whi Park, Sanjay Kumar, and Hak-Sung Kim |
204 | 109671 | 2026.05.01 |
| 257 |
Materials Today AdvancesNon-destructive evaluation of thermally induced structural transformation in PET using terahertz time-domain spectroscopyTae-Wan Kim, Sang-Il Kim, Heon-Su Kim, Chang-Jin Moon and Hak-Sung Kim |
29 | 100732 | 2026.03.01 |
| 256 |
Composites Part ADevelopment of the modified V-notched rail shear test for carbon fiber reinforced composites with multi-scale simulation method considering microscopic failure pointsGyu-Won Kim, Hyun-Ji Rho, Young-Wu Kim, Jun-Seop Song, Woe-Tae Kim, Dong-Hwi Kim, Jong-Whi Park, and Hak-Sung Kim |
202 | 109535 | 2025.12.26 |
| 255 |
Sensors and Actuators A: PhysicalMicrostructured anisotropic PDMS sheet for damage-free electrical testing of semiconductor packagesYu-lim Seol, Jae-heon Jeong, Ji-Hye Shim, Hak-Sung Kim, Hong-yun So |
399 | 117393 | 2025.12.10 |