ACHIEVEMENT
| 번호 | 제목 | 개최일 |
|---|---|---|
| 493 |
2026 대한기계학회 재료 및 파괴부문 춘계학술대회Thermomechanical Behavior of Advanced Semiconductor Packages Substrates during Multi-step ProcessesWoong-Kyoo Yoo, Sanjay Kumar, Jaesung Kim, Chaeyoung Ahn, Jinwoong Kim, Chan-Hyuk Park, Hak-Sung Kim |
2026.06 |
| 492 |
2026 대한기계학회 재료 및 파괴부문 춘계학술대회Accuracy enhancement for airbag deployment simulations considering the strain rate and temperature dependent mechanical properties of thermoplastic olefin and polypropyleneSe-Min Lee, Gyu-Won Kim, Jae-Hyun An, In-Soo Han, Hak-Sung Kim |
2026.06 |
| 491 |
2026 대한기계학회 재료 및 파괴부문 춘계학술대회Development of a Thermal Test Vehicle System for Evaluating the Thermal Behavior and Reliability of Advanced Semiconductor PackagesSeung-Won Lee, Gyu-Won Kim, Woong-Kyoo Yoo, Hak-Sung Kim |
2026.06 |
| 490 |
2026 대한기계학회 재료 및 파괴부문 춘계학술대회Optimization of Thermo-Compression Bonding Process and Reliability test of Self-assembly Anisotropic Conductive Adhesive for Fine Pitch InterconnectionsHye-Eun Lee, Tae-Wan Kim, Hyeong-Bin Park, Hak-Sung Kim |
2026.06 |
| 489 |
2026 대한기계학회 재료 및 파괴부문 춘계학술대회Effects of Applied Plating Current Density on Electrochemical Reliability of RDL: In-Situ ECM Testing and Lifetime PredictionHo-Jin Lee, Hae-Su Ahn, Ji-Hye Shim, Jun-Hyeong Park, Tae-Hoon Kim |
2026.06 |