ACHIEVEMENT
| 번호 | 제목 | 개최일 |
|---|---|---|
| 503 |
2026 대한기계학회 재료 및 파괴부문 춘계학술대회Non-destructive inspection of stealth laser diced lines in silicon wafers using cepstrum signal processing with terahertz electromagnetic wavesTae-Wan Kim, Sang-Il Kim, Heon-Su Kim, Jin-Sang Lim, Dong-Su Han, Hae-Gu Lee, Hak-Sung Kim |
2026.06 |
| 502 |
2026 대한기계학회 재료 및 파괴부문 춘계학술대회Milli-seconds multi flip-chip bonding process via intense pulsed light irradiation for advanced semiconductor packagingHak-Sung Kim |
2026.06 |
| 501 |
2026 대한기계학회 재료 및 파괴부문 춘계학술대회Prediction of Three-Dimensional Temperature Fields Using CFD-Pretrained Deep Neural Networks Enhanced by Transfer LearningSe-Jun Park, Young-Min Joo, Jong-Whi Park, Hak-Sung Kim |
2026.06 |
| 500 |
2026 대한기계학회 재료 및 파괴부문 춘계학술대회Enhanced Reliability of Flip-Chip Solder Joints via IPL Bonding and Surface Finish OptimizationHyeong-Bin Park, Young-Min Ju, Yun-Joong Kim, Hak-Sung Kim |
2026.06 |
| 499 |
2026 대한기계학회 재료 및 파괴부문 춘계학술대회Prediction of Warpage Behavior in Fan-Out Wafer Level Package Considering Manufacturing ProcessJun-Seop Song, Ho-Jin Lee, Ji-Hye Shim, Jun-Hyeong Park, Tae-Hoon Kim |
2026.06 |