ACHIEVEMENT
| 번호 | 제목 | 개최일 |
|---|---|---|
| 475 |
2026 IEEE 76th Electronic Components and Technology Conference (ECTC)In-Situ Cure Monitoring of EMC by Fiber Bragg Grating and Dielectric Sensors with Molecular Dynamics Validation for Accurate Warpage PredictionWoo-Jin An, Jeong-Hyeon Baek, Woong-Kyoo Yoo, Jun-Seop Song, Gyung-Hwan Oh, Dong-Woon Park, and Hak-Sung Kim |
2026.05 |
| 474 |
2026 IEEE 76th Electronic Components and Technology Conference (ECTC)Effects of Plating Current Density on Electrochemical Reliability of RDL: In-Situ Electrochemical Migration Testing and Time-to-Failure PredictionHo-Jin Lee, Jeong-Hyeon Baek, Hae-Su Ahn, Tae-Hoon Kim, Ji-Hye Shim, and Hak-Sung Kim |
2026.05 |
| 473 |
2026 IEEE 76th Electronic Components and Technology Conference (ECTC)High-Fidelity Reliability Prediction of SAC Solder under Drop Impact via High Strain Rate and Temperature-Dependent PropertiesDong-Hoon Yoo, You-Gwon Kim, Jin-Young Bang, Jong-Bum Lee Hak-Sung Kim |
2026.05 |
| 472 |
2026 한국반도체디스플레이기술학회 국내학술대회Finite Element Analysis Based Design Optimization of Heat Path Block Bonding Solder Hybrid Model in Semiconductor Packages김규원, 김진규, 문한별, 김학성 |
2026.05 |
| 471 |
2026 한국반도체디스플레이기술학회 국내학술대회Prediction of The Warpage for Large-scale Semiconductor Package Using Equivalent Model Considering The Anisotropic Thermomechanical Properties Based on Multi-physics Simulation유웅규, 안우진, 송준섭, 구형모, 김학성 |
2026.05 |