번호 제목 권(호) 출판년도
268

International Journal of Precision Engineering and Manufacturing-Green Technology

Distance from Neutral Point (DNP)–Induced Strain Gradients for Efficient Strain–Life Fatigue Evaluation of Solder Joints under Cyclic Four-Point Bending

Hyeong-bin Park, You-Gwon Kim, Jin-Young Bang, Jong-Bum Lee, and Hak-Sung Kim

(Submitted) 9999.99.99
267

Journal of Materials Processing Technology

Process-Driven Warpage Evolution in Advanced Semiconductor Substrates Role of Cu-Clad Laminate

Woong-Kyoo Yoo, Sanjay Kumar, Jaesung Kim, Chaeyoung Ahn, Jinwoong Kim, Chan-Hyuk Park, and Hak-Sung Kim

(Submitted) 9999.99.99
266

Corrosion Science

Corrosion lifetime prediction of electro-galvanized iron using potentiodynamic polarization and multiphysics simulation under different process and environmental conditions

Se-Jun Park, Ho-Jin Lee, Sang-Il Kim, Kwang-Soon Kim, Jae-Seok Choi, Gab-Seong Lee, and Hak-Sung Kim

(Submitted) 9999.99.99
265

Applied Surface Science

Decoupling PEG and chloride co-adsorption kinetics at copper/electrolyte interface during pattern-dependent electrodeposition

Sangmin Cho, Jeongwoo Park, Sangmin Park, Yulim Seol, Jihye Shim, HakSung Kim, Hongyun So

(Accepted) 167516 9999.99.99
264

Materials Characterization

FEA-integrated 3PB and BOR testing for accurate fracture strength evaluation of ultra-thin dies: effects of thickness and process conditions

Jun-Seop Song, Sang-Il Kim, Gyu-Won Kim, Woong-Kyoo Yoo, Jong-Woon Yoo, Sang-Hoon Ko, and Hak-Sung Kim

(Submitted) 9999.99.99