ACHIEVEMENT
| 번호 | 제목 | 권(호) | 쪽 | 출판년도 |
|---|---|---|---|---|
| 235 |
Journal of Materials Processing TechnologyMulti-Physics Coupled Modeling of Process-Induced Warpage in Advanced Fan-Out Wafer-Level Semiconductor PackagesJeong-Hyeon Baek, Jun-Seop Song, Woong-Kyoo Yoo, Woo-Jin An , Gyung-Hwan Oh, and Hak-Sung Kim |
174 | 355-369 | 2026.09.30 |
| 234 |
Journal of Electroanalytical ChemistryIntegrated Electrochemical Characterization and Finite Element Modeling for Optimizing Copper Filling in Through-Glass Vias: Kinetic Parameter Extraction and Profile PredictionYoung-Woo Kim, Jeong-Hyeon Baek, Se-Min Lee, Jong-Whi Park, Ho-Jin Lee, Tae-Hoon Kim, Ji-Hye Shim, Hongyun So and Hak-Sung Kim |
1017 | 120313 | 2026.09.15 |
| 233 |
Applied Surface ScienceDry Plasma-Enhanced Adhesion of Ti/Cu Seed Layers to ABF Substrates for Fine-Pitch Packaging ReliabilitySe-Min Lee, Hui-Jin Um, Na-Hyun Jeon, Hyun-Ji Rho, Soon-Oh Jeong, Young-Ju Han , Moo-Seong Kim and Hak-Sung Kim |
738 | 166954 | 2026.08.30 |
| 232 |
Journal of Energy StorageA dual-band terahertz analysis approach for concurrent measurement of battery separator thickness and porositySang-Il Kim, Tae-Wan Kim, Min-Woo Jeon, Heon-Su Kim, and Hak-Sung Kim |
169 | 122713 | 2026.08.15 |
| 231 |
Composite StructuresInfluence of Mechanical Pre-Strain under Varying Temperatures on Flexural Performance and Failure of 3D-Printed Carbon Fiber Sandwich StructuresSanjay Kumar, Hak-Sung Kim |
391 | 120563 | 2026.07 |