ACHIEVEMENT
| 번호 | 제목 | 권(호) | 쪽 | 출판년도 |
|---|---|---|---|---|
| 232 |
Journal of Energy StorageA Dual-Band Terahertz Analysis Approach for Concurrent Measurement of Battery Separator Thickness and PorositySang-Il Kim, Tae-Wan Kim, Min-Woo Jeon, Heon-Su Kim, and Hak-Sung Kim |
(Submitted) | 9999.99.99 | |
| 231 |
Engineering Fracture MechanicsA Unified Approach for Characterizing Fatigue Parameters of SAC305 Solder Joints using a Multi-DNP Specimen under Thermal CyclingYou-Gwon Kim, Dong-Hoon Yu, Hyeong-Bin Park, Min Seo, and Hak-Sung Kim |
(Submitted) | 9999.99.99 | |
| 230 |
Electrochimica ActaIntegrated Electrochemical Characterization and Finite Element Modeling for Optimizing Copper Filling in Through-Glass Vias: Kinetic Parameter Extraction and Profile PredictionYoung-Woo Kim, Jeong-Hyeon Baek, Se-Min Lee, Jong-Whi Park, Ho-Jin Lee, Tae-Hoon Kim, Ji-Hye Shim, Hongyun So and Hak-Sung Kim |
(Submitted) | 9999.99.99 | |
| 229 |
Materials Today AdvancesNon-destructive evaluation of thermally induced structural transformation in PET using terahertz time-domain spectroscopyTae-Wan Kim, Sang-Il Kim, Heon-Su Kim, Chang-Jin Moon and Hak-Sung Kim |
29 | 100732 | 2026.02.25 |
| 228 |
Composites Part ARapid PCB Warpage Modeling Through Automated Copper Pattern Classification and Classical Lamination Theory–Driven Anisotropic Viscoelastic HomogenizationWoong-Kyoo Yoo, Jeong-Hyeon Baek, Jong-Whi Park, Sanjay Kumar, and Hak-Sung Kim |
204 | 109671 | 2026.02.22 |