ACHIEVEMENT
| 번호 | 제목 | 권(호) | 쪽 | 출판년도 |
|---|---|---|---|---|
| 234 |
Journal of Electroanalytical ChemistryIntegrated Electrochemical Characterization and Finite Element Modeling for Optimizing Copper Filling in Through-Glass Vias: Kinetic Parameter Extraction and Profile PredictionYoung-Woo Kim, Jeong-Hyeon Baek, Se-Min Lee, Jong-Whi Park, Ho-Jin Lee, Tae-Hoon Kim, Ji-Hye Shim, Hongyun So and Hak-Sung Kim |
(Submitted) | 9999.99.99 | |
| 233 |
Composites Part B: EngineeringAnisotropic Viscoelastic Properties of Prepreg and Their Influence on Warpage of Thin PCB SubstratesSanjay Kumar, Woong-Kyoo Yoo, Jaesung Kim, Chae-Young Ahn, Jinwoong Kim, Chan Hyuk Park, and Hak-Sung Kim |
(Submitted) | 9999.99.99 | |
| 232 |
International Journal of FatigueDistance from Neutral Point (DNP)–Induced Strain Gradients for Efficient Strain–Life Fatigue Evaluation of Solder Joints under Cyclic Four-Point BendingHyeong-bin Park, You-Gwon Kim, Jin-Young Bang, Jong-Bum Lee, and Hak-Sung Kim |
(Submitted) | 9999.99.99 | |
| 231 |
Applied Surface ScienceDry Plasma-Enhanced Adhesion of Ti/Cu Seed Layers to ABF Substrates for Fine-Pitch Packaging ReliabilitySe-Min Lee, Hui-Jin Um, Na-Hyun Jeon, Hyun-Ji Rho, Soon-Oh Jeong, Young-Ju Han , Moo-Seong Kim and Hak-Sung Kim |
738 | 166954 | 2026.08.30 |
| 230 |
Materials Today AdvancesProcess-integrated in-situ characterization and multiscale modeling of cure-dependent thermo-mechanical behavior of highly silica filled epoxy composites for accurate warpage prediction in advanced semiconductor packagingJeong-Hyeon Baek, Woong-Kyoo Yoo, Woo-Jin An, Jun-Seop Song, Gyung-Hwan Oh, Ji-Hye Shim, and Hak-Sung Kim |
30 | 100781 | 2026.06 |