ACHIEVEMENT
| 번호 | 제목 | 권(호) | 쪽 | 출판년도 |
|---|---|---|---|---|
| 179 |
International Journal of Precision Engineering and Manufacturing-Green TechnologyInfluence of Pad Design on Assembly Reliability of Surface Mounted DevicesDong-Woon Park, Myeong-Hyeon Yu, Do-Hyung Kim, Dong-Min Jang, Jin-Woo Jang, Seung-Yeong Lee, and Hak-Sung Kim |
10 | 1235-1248 | 2022-10-27 |
| 178 |
Thin Solid FilmsNon-vacuum room temperature-processed pattering of molybdenum pattern by intense pulsed light irradiation for reliable electronic devicesChan-Jin Moon, Jong-Whi Park, Yong-Rae Jang, Young-Min Ju, Hak-sung Kim |
759 | 139468 | 2022-10-01 |
| 177 |
IEEE Robotics and Automation LettersEmpirical Validation of an Auxetic Structured Foot With the Powered Transfemoral ProsthesisWoolim Hong, Namita Anil Kumar, Shawanee Patrick, Hui-Jin Um, Heon-su Kim, Hak-Sung Kim and Pilwon Hur |
7(4) | 11228-11235 | 2022-10-01 |
| 176 |
Materials Science in Semiconductor ProcessingEffect of cure shrinkage of epoxy molding compound on warpage behavior of semiconductor packageJeong-Hyeon Baek, Dong-Woon Park, Gyung-Hwan Oh, Dong-Ok Kawk, Simon S. Park and Hak-Sung Kim |
148 | 106758 | 2022-09-01 |
| 175 |
Composite Structures3D printed continuous carbon fiber reinforced thermoplastic composite sandwich structure with corrugated core for high stiffness/load capabilityHui-Jin Um, Ji-Seok Lee, Ji-Hwan Shin, Hak-Sung Kim |
291 | 115590 | 2022-07-01 |