ACHIEVEMENT
| 번호 | 제목 | 권(호) | 쪽 | 출판년도 |
|---|---|---|---|---|
| 244 |
Journal of Materials Processing TechnologyMulti-Physics Coupled Modeling of Process-Induced Warpage in Advanced Fan-Out Wafer-Level Semiconductor PackagesJeong-Hyeon Baek, Jun-Seop Song, Woong-Kyoo Yoo, Woo-Jin An , Gyung-Hwan Oh, and Hak-Sung Kim |
(Submitted) | 9999.99.99 | |
| 243 |
Engineering Applications of Artificial IntelligenceDeep Neural Network Methodology for Predicting and Visualizing Passenger Airbag Deployment Dynamics: Toward Industrial ImplementationGyu-Won Kim, Se-Min Lee, Hyun-Ji Rho, Jae-Hyun An and Hak-Sung Kim |
(Submitted) | 9999.99.99 | |
| 242 |
Structural and Multidisciplinary OptimizationSurrogate-assisted design optimization of an automotive cowl crossbar for NVH performance using a DNN–GA frameworkSeung-Hyun Lee,Se-Min Lee,Gyu-Won Kim,Jae-Hyun An,Hak-sung Kim |
(Submitted) | 9999.99.99 | |
| 241 |
Engineering Fracture MechanicsA Unified Approach for Characterizing Fatigue Parameters of SAC305 Solder Joints using a Multi-DNP Specimen under Thermal CyclingYou-Gwon Kim, Dong-Hoon Yu, Hyeong-Bin Park, Min Seo, and Hak-Sung Kim |
(Submitted) | 9999.99.99 | |
| 240 |
Composites Part B: EngineeringAnisotropic Viscoelastic Properties of Prepreg and Their Influence on Warpage of Thin PCB SubstratesSanjay Kumar, Woong-Kyoo Yoo, Jaesung Kim, Chae-Young Ahn, Jinwoong Kim, Chan Hyuk Park, and Hak-Sung Kim |
(Submitted) | 9999.99.99 |