ACHIEVEMENT
| 번호 | 제목 | 권(호) | 쪽 | 출판년도 |
|---|---|---|---|---|
| 231 |
Materials and DesignReduced warpage in semiconductor packages: Optimizing post-cure temperature profile considering cure shrinkage and viscoelasticity of epoxy molding compoundHui-Jin Um, Young-Min Ju, Dae-Woong Lee, Jinho Ahn, and Hak-Sung Kim |
245 | 113265 | 2024-09-15 |
| 230 |
Composites ResearchStrain Rate and Temperature Effects on TPO and PP for Enhanced Airbag Deployment SimulationSe-Min Lee, Gyu-Won Kim,Jae-Hyun Ahn, In-Soo Han, Hak-Sung Kim |
37 | 325-329 | 2024-08-31 |
| 229 |
Journal of Rail and Rapid TransitReal-scale experiments of resistive heating laminate composite panels for radiant heating in railway vehiclesJuyeop Park,Donghoon Kang,Bonyoung Koo, Min-Ki Cho, and Hak-Sung Kim |
238 | 1328-1337 | 2024-08-16 |
| 228 |
비파괴검사학회지딥러닝과 테라헤르츠 기술을 이용한 세라믹-폴리머-금속 복합체 내부 결함 검사에 관한 연구You-Gwon Kim, Sang-Il Kim, Heon-Su Kim, Hak-Sung Kim |
44(3) | 172-179 | 2024-06-14 |
| 227 |
비파괴검사학회지테라헤르츠파를 사용한 반도체 패키지 내부 칩 정렬 비파괴 검사 기술에 관한 연구Sang-Il Kim, Heon-Su Kim, Hak-Sung Kim |
44(3) | 165-171 | 2024-06-14 |