번호 제목 권(호) 출판년도
162

Thin Solid Films

Enhancing intense pulsed light sintering characteristic of Cu nanoparticle/microparticle-ink using UV surface modification on polyimide substrate

Chung-Hyeon Ryu, Hui-Jin Um, and Hak-Sung Kim

701 137951 2020-05-01
161

Optics and Lasers in Engineering

In-Situ Monitoring of Moisture Diffusion Process for Wood with Terahertz Time-Domain Spectroscopy

Gyung-Hwan Oh, Heon-Su Kim, Dong-Woon Park and Hak-Sung Kim

128 106036 2020-05-01
160

Composite Structures

Design and manufacture of automotive composite front bumper assemble component considering interfacial bond characteristics between over-molded chopped glass fiber polypropylene and continuous glass fiber polypropylene composite

Sung-Jun Joo, Myeong-Hyeon Yu, Won Seock Kim, Jong-Wook Lee and Hak-Sung Kim

236 111849 2020-03-15
159

Materials & Designs

Prediction of fatigue life of semiconductor package under thermal cycling: combined effect of package design and solder materials

Heon-Su Kim, You-Gwon Kim, Dong-Min Jang, Jin-Woo Jang, Seung-Yeong Lee, and Hak-Sung Kim

999 202-05-05
158

AIP Advances

Direct evaluation method to measure permittivity and conductivity of thin layers via wave approach in the THz region

Yun-Sang Kwak, Sang-Mok Park, Sin-Yeob Lee, Hak-Sung Kim, Ju Lee and Jun-Hong Park

9(11) 115113 2019-11-20