ACHIEVEMENT
| 번호 | 제목 | 권(호) | 쪽 | 출판년도 |
|---|---|---|---|---|
| 200 |
IEEE Robotics and Automation LettersEmpirical Validation of an Auxetic Structured Foot With the Powered Transfemoral ProsthesisWoolim Hong, Namita Anil Kumar, Shawanee Patrick, Hui-Jin Um, Heon-su Kim, Hak-Sung Kim and Pilwon Hur |
7(4) | 11228-11235 | 2022-10-01 |
| 199 |
Journal of the Microelectronics and Packaging SocietyDelamination Prediction of Semiconductor Packages through Finite Element Analysis Reflecting Moisture Absorption and Desorption according to the Temperature and Relative HumidityHui-Jin Um, Yeon-Taek Hwang, Hak-Sung Kim |
29(3) | 37-42 | 2022-09-29 |
| 198 |
Journal of the Microelectronics and Packaging SocietyDevelopment of Warpage Simulation Method according to Thermal Stress based on Equivalent Anisotropic Viscoelastic ModelHeon-Su Kim, Hak-Sung Kim |
29(3) | 43-48 | 2022-09-29 |
| 197 |
Journal of the Microelectronics and Packaging SocietyA Study on Effect of Pad Design on Assembly and Adhesion Reliability of Surface Mount Technology (SMT)Dong-Woon Park, Myeong-Hyeon Yu, Hak-Sung Kim |
29(3) | 31-35 | 2022-09-29 |
| 196 |
Materials Science in Semiconductor ProcessingEffect of cure shrinkage of epoxy molding compound on warpage behavior of semiconductor packageJeong-Hyeon Baek, Dong-Woon Park, Gyung-Hwan Oh, Dong-Ok Kawk, Simon S. Park and Hak-Sung Kim |
148 | 106758 | 2022-09-01 |