ACHIEVEMENT
| 번호 | 제목 | 권(호) | 쪽 | 출판년도 |
|---|---|---|---|---|
| 208 |
Journal of the Microelectronics and Packaging SocietySolder Alloy Types and Solder Joint Reliability Evaluation TechniquesYou-Gwon Kim, Heon-Su Kim, Tae-Wan Kim, Hak-Sung Kim |
30(1) | 17-29 | 2023-03-30 |
| 207 |
International Journal of Precision Engineering and Manufacturing-Green TechnologyIntense pulsed light welding process with mechanical roll-pressing for highly conductive silver nanowire transparent electrodeYoung-Min Ju, Jong-Whi Park, Yong-Rae Jang, Simon. S. Park, and Hak-Sung Kim |
11 | 203-219 | 2023-01-05 |
| 206 |
Journal of the Microelectronics and Packaging SocietyMeasurement of effective cure shrinkage of EMC using dielectric sensor and FBG sensorJeong-hyeon Baek, Dong-woon Park and Hak-sung Kim |
29(4) | 83-87 | 2022-12-30 |
| 205 |
Mechanical Systems and Signal ProcessingMetal forming defect detection method based on recurrence quantification analysis of time-series load signal measured by real-time monitoring system with bolt-type piezoelectric sensorIn-Je Jang, Gi-Hyun Bae, and Hak-Sung Kim |
180 | 109457 | 2022-11-15 |
| 204 |
Structural Health MonitoringMachine-Learning Based Damage sensing and Self-Healing of Carbon Fiber/Nylon Composites via Addressable Conducting NetworksMyeong-Hyeon Yu, Ji-Seok Lee, Hak-Sung Kim |
22(5) | 3401-3415 | 2022-11-02 |