Advanced Packaging Innovation Laboratory · Hanyang University
Reliability for the next generation of semiconductor packaging
차세대 반도체 패키징의 공정·계측·신뢰성 예측을 연구합니다.
APIL, led by Prof. Hak-Sung Kim in the Department of Mechanical Engineering, develops processes, in-situ metrology and physics-based reliability prediction for advanced semiconductor packaging — from intense-pulsed-light bonding and glass substrates to terahertz inspection and warpage modeling.
Design, bonding, AI and inspection — across the package.
Four key research areas: package design and reliability, next-generation bonding, AI-based prediction and control, and THz / lock-in thermography inspection.
본 연구실은 첨단 반도체 패키징 설계·신뢰성 평가, 차세대 반도체 본딩 공정 개발, 인공지능 응용 기술, 테라헤르츠파 및 LIT 기반 비파괴 검사 기술을 4대 핵심 연구 분야로 하여, 소재–공정–검사–예측을 아우르는 첨단 패키징 연구를 수행하고 있습니다. 연구실은 광소결(IPL)·인쇄전자와 복합재료 연구의 기반 위에, 현재 첨단 반도체 패키징을 중심으로 한 APIL(Advanced Packaging Innovation Laboratory)로 발전하였습니다.
Laser spallation test set-up for measuring thin-film interfacial strength
01
Advanced Package Design & Reliability
첨단 반도체 패키징 설계·신뢰성 평가
Package design & manufacturing reliability evaluation첨단 패키지 설계·제조 신뢰성 평가
Package material characterization & reliability evaluation첨단 패키지 소재 물성·신뢰성 평가
Precise interfacial adhesion measurement패키지 계면 접착력 정밀 측정 연구 (laser spallation, DCB/FPB)
Warpage prediction from cure-dependent, viscoelastic EMC models; solder-joint fatigue and drop reliability; RDL electrochemical and thermal-cycling reliability; physics-informed AI for package reliability.
Hidden defects found in THz images of a polymer tube
Continuous-DDPG reinforcement-learning temperature control of a cold-storage facility, and GAN-based anomaly detection (AnoGAN) of hidden defects in terahertz scanning images.
03
AI-Based Applications
인공지능 응용 기술
CNN-based simulation meta-modelsCNN 기반 해석 meta-model 개발
CNN / GAN-based defect predictionCNN/GAN 기반 결함 예측 기법 개발
Reinforcement learning (DDPG)-based control강화학습(DDPG) 기반 제어 연구
Deep-learning surrogates that replace slow finite-element runs, generative models that find hidden defects in inspection images, and reinforcement-learning controllers — including a 50% energy reduction in a real cold-storage facility.
Featured in Composites Part B (IF 14.2) · Applied Energy (IF 11.0)
★ Major award · 대표 수상2026Haedong Young Engineer Award해동젊은공학인상 (학술부문)Haedong Foundation & Korea Microelectronics and Packaging Society (KMEPS) · January 2026Cover articleUltra-millisecond flip-chip bonding via intense pulsed light — ACS Appl. Mater. Interfaces (2025)Featured articlePlasmonic welding of Ag nanowires by IPL + NIR — Nanoscale (2020)Excellent S&T Paper Award35th KOFST Excellent Paper Award — THz inspection of chip alignment in packages (2025)President's CommendationHanyang University — technology transfer with royalties above KRW 1 billion (2025)
Lab Facility · 연구 장비
From wafer processing to failure analysis.
본 연구실은 한양 첨단 반도체 패키징 연구센터와 함께 공정·본딩, 신뢰성 평가, 비파괴 및 파괴 분석에 이르는 연구·시험 장비를 운영하고 있습니다.
Process & Bonding 공정·본딩 장비4
Semiconductor 8" Wafer RDL/TSV Plating Cage8인치 웨이퍼 RDL/TSV 도금 장비
200 Gb/s/λ급 Tx-Rx 고집적 Co-Packaged Optics·초미세 인터커넥트 고신뢰 통합 설계·검증 플랫폼 구축
Overall Principal Investigator · 총괄 연구책임자Prof. Hak-Sung Kim 김학성 교수
Hanyang University · leads the 6-institution, 8-PI K-CHIPS consortium
A five-year K-CHIPS project led by Prof. Hak-Sung Kim as overall PI, with APIL heading a six-institution consortium. Sending 200 Gb/s per wavelength through a co-packaged optics (CPO) module couples high-power electrical signals, heat, thermo-mechanical deformation and optical alignment, yet no design platform handles these multiphysics together. The project builds one data-, model- and verification-based platform that unites intelligent design, electro-optical co-simulation and ultra-fine, high-reliability interconnects.
CPO에서 200 Gb/s/λ급 신호를 안정적으로 전송하려면 발열, 열·기계적 변형, 광 정렬 손실과 전기 노이즈를 함께 고려한 설계가 필요하지만, 다중물리를 통합한 CPO 설계 플랫폼은 아직 없습니다. 본 과제는 지능형 설계–전기·광 융합 해석–초미세 고신뢰 접합을 통합한 데이터·모델·검증 기반 통합 플랫폼을 구축합니다.
Key challenges of a 200 Gb/s/λ Tx–Rx CPO: heat dissipation, reliable interconnects, optical-coupling efficiency, CPO wiring, thermally induced index change and thermo-mechanical deformation.
Program
K-CHIPS · MOTIE / KEIT
Period
2026.04 – 2030.12 57 months · 2 phases
Consortium
6 institutions · 8 PIs Overall PI: Prof. Hak-Sung Kim (Hanyang Univ.)
Budget
KRW 4.5 billion Government 2.25 B + private 2.25 B
Why a multiphysics platform · 연구 필요성
High-power electrical signals along package wiring cause strong self-heating in a CPO package.패키지 배선을 따라 흐르는 고전력 전기 신호가 높은 발열을 유도
Heat changes material properties and drives warpage, damage and fracture — and in an alignment-critical CPO it produces severe optical-signal loss.열에 의한 물성 변화·기계적 변형이 극심한 광학 신호 손실을 야기
Stable high-speed transmission needs low-noise, high-reliability CPO wiring and interconnects.간섭·노이즈를 최소화하는 고신뢰 전기배선 및 interconnect 설계 필요
Photonic design, optical-coupling loss, SI/PI, ultra-fine bonding, packaging reliability and thermo-mechanical-optical co-simulation must therefore be solved together.Multiphysics Simulation + Packaging + Interconnect + AI Design 의 다학제 융합 연구
AI defect detection ≤ 30 µm (lateral) and ≤ 100 µm (spatial)
Micro/nano-mechanical properties of internal structures ≤ 100 nm
한양대 김학성 (총괄 PI · APIL) · 서울대 최인석
APIL's role · 세부목표 7 · led by the overall PI
Fluxless fine-pitch bonding and lock-in-thermography defect diagnosis
차세대 초미세 인터커넥트 결함 진단 및 Fine pitch 범프 고신뢰 접합 기술 개발 — 김학성 교수
Reflow and flux-based bonding suffer from alignment error and flux residue. APIL develops UV/plasma fluxless bonding and self-assembled nano-soldering for high-strength interconnects, and phase-locked infrared (lock-in) thermography with deep-learning models for non-destructive, quantitative detection of micro-defects.
Year 1Fluxless and self-assembled nano-solder bonding mechanisms; non-destructive inspection system
Year 2UV/plasma fluxless process · alignment ≤ 20 µm, shear ≥ 3 MPa · detection ≤ 100 µm
Year 3Real-time bond-strength evaluation · ≤ 10 µm, ≥ 6 MPa · AI detection ≤ 70 µm
Year 4Fine-pitch process optimisation · ≤ 8 µm, ≥ 9 MPa · ≤ 50 µm
Policy · 정책Domestic AI design-and-analysis platform for semiconductor design and data sovereignty; design and verification standards for next-generation packaging.
Technology · 기술Electro-optical-thermal multiphysics platform, AI-accelerated design, real-time ROM/PINN analysis and quantitative criteria for fine-pitch bonding.
Industry · 산업Core CPO and HBM technology for AI/HPC, shorter design cycles and lower cost, and a domestic platform ecosystem.
Society · 사회Energy-efficient optical interconnects for data centres, and M.S./Ph.D. engineers trained across materials, simulation and AI.
Consortium한양대학교 김학성 (총괄 연구책임자)·소홍윤 · 서울대학교 류일·최인석 · 한양대학교 ERICA 김영현 · KAIST 유경식 · 연세대학교 이남규 · 세종대학교 김영우
200 Gb/s/λ급 Tx-Rx 고집적 CPO·초미세 인터커넥트 고신뢰 통합 설계·검증 플랫폼 구축
Prof. Hak-Sung Kim is the overall PI; APIL leads a six-institution consortium (with SNU, Hanyang ERICA, KAIST, Yonsei and Sejong) to build a multiphysics design platform for co-packaged optics: thermal and warpage simulation, ROM/AI-based thermo-mechanical prediction, ultra-fine interconnect bonding and thermography-based defect inspection.
Co-packaged opticsWarpageROM / AI agentInterconnect
NRF — Innovation Research Center (IRC)2023.09 – 2033.02 · Co-PI
H3 (Extreme Scale, Extreme Properties, Heterogeneous Integration) Semiconductor Technology Research Center
H3 (극한 스케일·극한 물성·이종 집적) 한계 극복 반도체 기술 연구 센터
Ten-year center program. APIL develops in-situ process monitoring and reliability evaluation technologies for advanced semiconductor packages.
Process monitoringReliabilityHeterogeneous integration
MOTIE — Advanced Packaging Leading Technology (with Hana Micron)2025.04 – 2028.12 · PI
Redistribution interposer with embedded passive components and bridge dies
산업수요연계 수동소자와 브릿지 다이를 내장하는 재배선 인터포저 혁신제품형 기술개발
Process, performance and reliability criteria for an RDL interposer that embeds passives and bridge dies — electroplating, warpage control and reliability of fine-line RDL.
RDL interposerBridge dieWarpage
MOTIE — Automotive Industry Technology (Smart Car), with Hana Micron2025.04 – 2028.12 · Participating
Core packaging technologies for reliable chiplet-based high-performance automotive semiconductors
칩렛 기반 고성능 차량용 반도체의 신뢰성 확보를 위한 패키징 핵심 기술 개발
Multiphysics analysis and reliability assessment of chiplet packages for automotive use, in collaboration with Prof. Hong-Yun So's group at Hanyang.
High-thermal-conductivity paste sinter bonding with silver-complex nanofillers for WBG power-semiconductor die attach
고분산성 은 착물 나노필러소재를 적용한 WBG 전력반도체 다이 본딩용 고방열 페이스트 소결 접합 기술 개발 및 실증
Silver-complex nanofiller pastes and sinter-bonding processes for SiC/GaN power modules, with thermal-shock and creep-based life prediction.
WBG powerAg sinteringDie attach
MSIT — K-HERO Global Leading Lab2025.07 – 2028.12 · Participating
Low-melting nano-composite interconnect materials with anisotropic conductivity at sub-micron pitch via nano-soldering
나노 솔더링에 의한 극미세피치 이방 도전성 저융점 나노 복합 인터커넥트 소재 기술 개발
APIL evaluates bonding and reliability of ultra-fine-pitch interconnects: thermo-compression bonding at 40 µm and 20 µm pitch, die-shear strength and real-time daisy-chain resistance monitoring.
Fine-pitchNano-solderTC bonding
ETRI-led Strategic Research Program2026 – 2030 · Participating
Athermal bonding equipment and materials for high-density semiconductor packaging
고집적 반도체 무열성 장비 및 소재 개발
Real-time monitoring and coupled thermal analysis of laser-assisted bonding and curing processes, supporting fine-pitch chiplet bonding without global heating.
Laser-assisted bondingCure monitoringChiplet
Industry collaboration · 산학 협력과제 12
Samsung Electronics2025 – present · PI
Physics-informed neural networks for package reliability prediction
삼성전략산학과제 4기 — 패키지 신뢰성 PINN 기반 예측 연구
Physics-informed and data-augmented models that predict thermo-mechanical reliability of glass-core 2.xD/3D packages from limited test and simulation data (now in its second year).
PINNGlass 2.xD/3DBEOL
Samsung Electronics2024 – 2026 · PI
Glass carrier material improvement through warpage simulation
워피지 해석 기반 글라스 캐리어 소재 개선
Warpage simulation of fan-out wafer-level processes on glass carriers to guide carrier material and process design.
FOWLPGlass carrierWarpage
Samsung Electronics2026 · PI
High-strain-rate properties of solder-joint IMC layers and board-level simulation correlation
Solder 접합 IMC층 고속 물성 확보 및 Board Level 해석 정합성 확보
Measuring rate-dependent properties of intermetallic layers and feeding them into board-level drop and impact simulations.
Solder IMCHigh strain rateDrop reliability
Samsung Electronics2026.03 – 2027.02 · PI
Laser-grooving depth metrology using lock-in thermography
Lock-in thermography 기반 Laser grooving depth 계측 요소기술 개발
Non-contact, non-destructive measurement of deep laser-groove depth in low-k wafers by analysing phase response at multiple excitation frequencies.
Lock-in thermographyLaser groovingMetrology
SK hynix2026.01 – 2027.12 · PI
Simulating BEOL delamination and cracking in package dicing (SDBG) processes
PKG DP 공정 (BEOL 박리/크랙) 현상 모사 기법 연구
Interfacial fracture toughness of BEOL interfaces (DCB/FPB), XFEM/CZM crack-propagation models of stealth-dicing-before-grinding, and fractography-based crack-mode guidelines.
BEOLStealth dicingFracture mechanics
SEMES2026 – present · PI
Lock-in thermography inspection of near-micron voids in hybrid bonding
LIT를 활용한 Dry 환경에서의 Near-micron (void ≤ 10 µm) 하이브리드 본딩 계측 기술 개발
Dry, water-free detection of ≤10 µm voids at hybrid-bonded interfaces, with deep-learning classification of defect type and size.
Hybrid bondingLITDeep learning
SEMES — Plasma Cluster2022.03 – 2027.09 · PI
Terahertz monitoring of plasma surface activation for hybrid bonding
테라헤르츠파 기반 하이브리드 본딩 플라즈마 표면 활성화 모니터링 및 공정 최적화
Relating THz spectral features to plasma-activated surface states and bond strength, to select the plasma process window before bonding.
TerahertzPlasma activationHybrid bonding
LX Semicon2025.04 – 2028.03 · PI
Heat-dissipation components, ceramic substrates and simulation framework
방열 부품 및 세라믹 방열 기판 기술 개발 및 시뮬레이션 체계 구축
Performance improvement of heat-dissipation parts and ceramic substrates, and standardised simulation procedures for their design.
Thermal managementCeramic substrate
Dongwoo Fine-Chem2026 · PI
Organic coating materials and high-thermal-conductivity package materials
반도체용 유기 코팅 소재 및 고방열 패키지 소재 연구
Interfacial adhesion of thin organic films (micro-shear, laser spallation), cure-aware EMC warpage prediction, and biased-HAST reliability of molding compounds.
EMCLaser spallationHAST
ICD2024.10 – 2026.10 · PI
Dishing reduction and hybrid bonding process optimisation
Dishing 저감 및 하이브리드 본딩 공정 최적화
Cu dishing control and bonding-process optimisation for Cu/dielectric hybrid bonding.
Hybrid bondingCu dishing
Hyundai Motor Company2026 · PI
Temperature prediction model for EV integrated charging & converter units (ICCU)
전기차 ICCU 온도 예측 모델 개발 및 검증
Thermo-electrical simulation of power boards combined with lightweight deep-learning virtual sensors that estimate hot-spot temperature from a minimal set of sensors.
Virtual sensorPower electronicsDeep learning
Hyundai Motor Company2026 · PI
Thermal-resistance measurement of traction-motor materials and thermal network modelling
모터 소재 열저항 측정 및 열 해석 모델 연구
Through-thickness thermal conductivity of stator cores and insulation materials, feeding a 1D lumped thermal network of the motor.
Thermal conductivitye-MotorLPTN
Also: Advanced Industry Specialized Graduate School (Semiconductor), MOTIE, 2024–2029 — PI. Industry partners include Samsung Electronics, SK hynix, SEMES, LX Semicon, Hana Micron, Hyundai Motor, Dongwoo Fine-Chem and ICD.
Invited seminars: University of Bristol (2023), KAIST (2023), SAIT (2023)
30+ invited technical seminars for industry since 2020
Student achievements · 학생 수상 및 성과
Ph.D. Dissertation Excellence Award, Hanyang University박사학위 우수논문상 — 김상일 (융합기계공학과) “Non-destructive monitoring of thin-film manufacturing processes using terahertz electromagnetic waves”
Ph.D. commencementCongratulations to Dr. Sang-Il and Dr. Jeong-Hyeon on completing their doctoral degrees.
Excellent Paper Presentation Award, Korean Society for Nondestructive Testing우수논문발표상 (2025 추계학술대회) — 김태완 · 김상일 · 김헌수 · 김학성 「테라헤르츠파를 사용한 실시간 폴리머 열화 검사 기술에 관한 연구」
20th Semiconductor ScholarshipAn APIL student received the scholarship certificate at the 20th Semiconductor Scholarship Ceremony.
35th Science & Technology Excellent Paper Award (KOFST)「테라헤르츠파를 사용한 반도체 패키지 내부 칩 정렬 비파괴 검사 기술에 관한 연구」
Best Paper Award, Journal of the Korean Society for Nondestructive Testing (2024)비파괴검사학회지 우수논문상 — 김상일 · 김헌수 · 김학성 「테라헤르츠파를 사용한 반도체 패키지 내부 칩 정렬 비파괴 검사 기술에 관한 연구」
Researchers & Students · 연구원 및 학생
As of October 2026, from member profiles. Journal papers, conference presentations, patents and awards are listed.
Postdoctoral Researcher · 박사후연구원 1
Dr. Sanjay Kumar
Postdoctoral Researcher
3D-printed continuous-fiber composites and multifunctional sandwich structures
Journal papers · 논문 34
Kumar, S., Yoo, W-K., Kim, J., Ahn, C-Y., Kim, J., Park, C-H., Kim, H-S (2026), Anisotropic viscoelastic properties of prepreg and their influence on warpage of thin PCB substrates. Composites Part A: Applied Science and Manufacturing, 211, 110151-1–110151-17, (SCI, Q1, Impact factor-8.90, Rank-6/34). https://doi.org/10.1016/j.compositesa.2026.110151
Yoo W-K., Baek, J-H., Park, J-W., Kumar S., Kim., H-S (2026), Rapid PCB warpage modeling through automated copper pattern classification and classical lamination Theory–Driven anisotropic viscoelastic homogenization. Composites Part A: Applied Science and Manufacturing, 204, 109671- 109686, (SCI, Q1, Impact factor-8.90, Rank-6/34). https://doi.org/10.1016/j.compositesa.2026.109671
Kumar S., Yoo, D. H., Song, J. S., & Kim, H. S, (2026), A critical review of the past, present, and future of 3D printing for continuous and short fiber composites. Composite Structures, 376, 119819/1-119819/48, (SCI, Q1, Impact factor-7.310, Rank-8/171) https://doi.org/10.1016/j.compstruct.2025.119819
Kumar S., Kim., H-S. (2026), Influence of mechanical pre-strain under varying temperatures on flexural performance and failure of 3D-printed carbon fiber sandwich structures. Composite Structures, 391, 120563/1-120563/20, (SCI, Q1, Impact factor-7.310, Rank-8/171) https://doi.org/10.1016/j.compstruct.2026.120563
Lee, K-M., Masud, M., Kumar S., Shin, D-H., Kim., Y-H. (2026), Investigation of open-hole and temperature effects on Mode I fracture behavior of unidirectional CF/PEKK composites. Journal of Materials Research and Technology, 40, 2026-2039, (SCI, Q1, Impact factor-6.60, Rank-23/130). https://doi.org/10.1016/j.jmrt.2025.12.279
Lee, K-M., Kumar S., Shin, D-H., Kim, Y-H. (2026), Fracture toughness and crack propagation analysis in CF/PEKK composites with hole defect: A comparative study of MBT and CBBM methods. International Journal of Modern Physics B, 40, 2640010/1–2640010/13, (SCI, Q2, Impact factor-2.80, Rank-88/187). DOI: 10.1142/S0217979226400102
Kumar, S., Yoo, D. H., Song, J. S., & Kim, H. S (2025), Effect of geometric configurations and heat treatment on the tensile properties, joint performance, and failure behavior of 3D-Printed carbon and glass fiber composites. Composites Part B: Engineering, 304, 112693- 112708, (SCI, Q1, Impact factor-14.20, Rank-1/175). https://doi.org/10.1016/j.compositesb.2025.112693
Kim, Y. H., Kumar, S., Li, X., Kim, S. Y., Shin, D. H. (2025), Temperature-dependent mechanical properties and material modifications of carbon fiber composites for optimized structures in high-end industrial applications. Composites Part B: Engineering, 303, 112602-112627, (SCI, Q1, Impact factor-14.20, Rank-1/175). (Sanjay Kumar is corresponding author). https://doi.org/10.1016/j.compositesb.2025.112602
Kim., Y-H., Kumar S., Lee, K-M., Kim, S-Y., Yoon, S-Y., Bae, S-Y., Shin,D-H. (2025), Advancing Carbon Fiber and its Composites Technology: Korea's Strategic Growth and Innovation. Composites Part B: Engineering, 296, 112266-112292, (SCI, Q1, Impact factor-14.20, Rank-1/175). (Sanjay Kumar is corresponding author). https://doi.org/10.1016/j.compositesb.2025.112266
Kumar S., Hwang, D-W., Li X., Shin,D-H., Kim., Y-H. (2025), Synergistic Effects of Extreme Temperature and Pre-Bending on CF/PEKK Composite Flexural Characteristics. Polymer Composites, 46, 1‐19, (SCI, Q2, Impact factor-4.70, Rank-10/35). http://doi.org/10.1002/pc.29292
Lee, K-M., Kumar S., Kim, S-Y., Shin,D-H., Wu C-M., Kim., Bae, S-Y., Y-H. (2025), Geometric Effects on the Fracture Toughness and Delamination Behaviors of Carbon Fiber/Polyetherketoneketone Composites with Open Holes and Bolted Joints. Thin-Walled Structures, 210, 113045-113057, (SCI, Q1, Impact factor-6.60, Rank-13/182). (Kyo-moon Lee and Sanjay Kumar are equal first author). https://doi.org/10.1016/j.tws.2025.113045
Hwang, D-W., Kumar S., Jo, S-M., Kim., Y-H. (2025), Comparison of pin-loaded tensile behavior and failure behavior of thermosetting and thermoplastic composite. Mod. Phys. Lett. B, 39, 2441014- 2441022, (SCI, Q3, Impact factor-2.20, Rank- 117/187). DOI: 10.1142/S0217984924410148
Bang, T-S., Kumar S., Kim., Y-H. (2025), Delamination mechanism in CF/EPOXY with open hole under mode II loading at different distances. Mod. Phys. Lett. B, 39, 2441013- 2441020, (SCI, Q3, Impact factor-2.20, Rank- 117/187). DOI: 10.1142/S0217984924410136
Li X., Kumar S., Hwang, D-W., Kim., Y-H. (2025), Temperature-dependent pinned joint tensile behavior and failure analysis of CF/PEKK composites. Mod. Phys. Lett. B, 39, 2441011- 2441019, (SCI, Q3, Impact factor-2.20, Rank- 117/187). DOI: 10.1142/S0217984924410112
Park, Y-R., Kumar S., Naz, A., Kim., Y-H. (2025), Flexural behavior of carbon/epoxy nanocomposite pipes with interleaved structure. Mod. Phys. Lett. B, 39, 2441010- 2441019, (SCI, Q3, Impact factor-2.20, Rank- 117/187). DOI: 10.1142/S0217984924410100
Kim, K-M., Kumar S., Kim., Y-H. (2025), Optimizing bonding performance in CF/PEKK composites: The role of IR heating and press consolidation. Mod. Phys. Lett. B, 39, 2441005- 2441017, (SCI, Q3, Impact factor-2.20, Rank- 117/187). DOI: 10.1142/S0217984924410057
Wu, C. M., Sood, M., Lin, P. C., Kumar, S., Chen, J. C., & Shen, M. Y. (2025), Effect of the elliptical perforation on the stress/strain concentration in the self-reinforced polyethylene terephthalate composites. Polymer Composites, 46, S98-S112, (SCI, Q2, Impact factor-4.70, Rank-10/35). https://doi.org/10.1002/pc.29953
Lee, K-M., Kumar S., Yoon, S-W., Park, C-W., Nods, N-K., Kim., Y-H. (2025), Mode II Fracture Behavior of CF/PEKK Composites with Open-Hole and Bolted Joint Geometries at High-Temperatures. Composites Communications, 60, 102654- 102673, (SCI, Q1, Impact factor-7.70, Rank-7/34). https://doi.org/10.1016/j.coco.2025.102654
Li X., Kumar S., Hwang, D-W., Shin,D-H., Bae, S-Y., Kim., Y-H. (2024), Geometry and Temperature Effects on Tensile Properties and Failure Behaviors of Open-Hole and Bolted-Joint CF/PEKK Composites. Composites Part A: Applied Science and Manufacturing, 185, 108336-108347, (SCI, Q1, Impact factor-8.90, Rank-6/34). (Xiaoqi Li and Sanjay Kumar contributed equally to this work, equal first author). https://doi.org/10.1016/j.compositesa.2024.108336
Too, D-K., Kumar S., Shin,D-H., Kim., Y-H. (2024), Synergistic Toughening of CFRP Laminates using Melt-infused Thermoplastic Interleaves and Toughened Epoxy. Composites Communications, 53, 102192-102205. (SCI, Q1, Impact factor-7.70, Rank-7/34). (Daniel Kipkirui Too and Sanjay Kumar contributed equally to this work, equal first author). https://doi.org/10.1016/j.coco.2024.102192
Too, D-K., Kumar S., Kim., Y-H. (2024), Fracture toughness and failure behavior of CF/epoxy composites interleaved with melt-infused PET, PEI,and PEEK film. Polymer Composites, 45, 12307-12324, (SCI, Q2, Impact factor-4.70, Rank-10/35). https://doi.org/10.1002/pc.28637
Kumar S., Hwang, D-W., Kim., Y-H. (2024), Effects of temperature and pre-bending on the flexural properties of carbon fiber/epoxy composites. International Journal of Modern Physics B, 38, 2440020- 2440029, (SCI, Q2, Impact factor-2.80, Rank-88/187). (Sanjay Kumar and Dong Wook Hwang contributed equally to this work) DOI: 10.1142/S0217979224400204
Kim, S-Y., Kumar S., Hwang, D-W., Kim., Y-H. (2024), Investigating the impact of extreme environments on the interlaminar performance of nanoparticle-reinforced carbon fiber composites. International Journal of Modern Physics B, 38, 2440026- 2440035, (SCI, Q2, Impact factor-2.80, Rank-88/187). (Se-Yoon Kim and Sanjay Kumar contributed equally to this work, equal first author) DOI: 10.1142/S0217979224400265
Li X., Kumar S., Kim., Y-H. (2024), Lap shear properties of CF/PEKK composites through nanoparticle-enhanced adhesive joints. International Journal of Modern Physics B, 38, 2440025- 2440035, (SCI, Q2, Impact factor-2.80, Rank-88/187). (Xiaoqi Li and Sanjay Kumar contributed equally to this work) DOI: 10.1142/S0217979224400253
Kumar S., Hwang, D-W., Kim, S-Y., Li X., Kim., Y-H. (2024), Investigation of the influence of halloysite nanotubes (HNT) on the low-velocity impact behavior of carbon fiber-reinforced epoxy composites. International Journal of Modern Physics B, 38, 2440027- 2440037, (SCI, Q2, Impact factor-2.80, Rank-88/187). DOI: 10.1142/S0217979224400277
Sangamesh, R., Hiremath, S., Biradar, S., Kumar, S., Sondar, P., & Vishwanatha, H. M. (2024). Erratum to “Effect of alkaline treatment on mechanical properties of natural fiber-reinforced composite”. Journal of Mechanical Science and Technology, 38(12), 6597-6605. (Q3, Impact factor-1.70, Rank-118/182). https://doi.org/10.1007/s12206-024-1245-z
Kumar S., Park, Y-R., Kim., Y-H. (2023), Optimization of Interleaved Structures with Amorphous Halloysite Nanotubes for Superior Performance of CFRP Pipes in Various Environmental Conditions. Thin-Walled Structures, 193, 111301-111312, (SCI, Q1, Impact factor-6.60, Rank-13/182). (Sanjay Kumar and Ye-Rim Park contributed equally to this work). https://doi.org/10.1016/j.tws.2023.111301
Li X., Kumar S., Hwang, D-W., Shin,D-H., Kim., Y-H. (2023), Pin-Loaded Tensile Behavior and Failure Analysis of CF/PEKK Composites under Extreme Temperature. Composites Part A: Applied Science and Manufacturing, 175, 107823-107835, (SCI, Q1, Impact factor-8.90, Rank-6/34). (Xiaoqi Li and Sanjay Kumar contributed equally to this work, equal first author). https://doi.org/10.1016/j.compositesa.2023.107823
Hwang, D-W., Kumar S., Park, S-J., Shin,D-H., Kim., Y-H. (2023), Evaluation of the bending strength of preloaded CF/PEKK at high temperature. Mod. Phys. Lett. B, 37, 2340028/1-2340028/8. (SCI, Q3, Impact factor-2.20, Rank- 117/187). https://doi.org/10.1142/S0217984923400286
Kim, S-Y., Park, S-J., Kumar S., Kim., Y-H. (2023), Impact strength and fracture behavior of Halloysite nanotube (HNT)-modified carbon fiber-reinforced polymers (CFRPs) based on the electrophoretic dispersion (EPD) process. Mod. Phys. Lett. B, 37, 2340035- 2340042, (SCI, Q3, Impact factor-2.20, Rank- 117/187). https://doi.org/10.1142/S0217984923400353
Kumar S., Wu C-M., Chen, J. C.; Shimamura Y. (2022), Strain concentration of double-edge hole ductile composites in the full range of deformation by digital image correlation. Express Polymer Letters, 16, 1038-1051, (SCI, Q3, Impact factor-2.60, Rank-54/94). https://doi.org/10.3144/expresspolymlett.2022.76
Wu, C. M.; Kumar, S.; Lin, P. C.; Chen, J. C. (2022), Strain and stress concentration of ductile composites in full-range deformation by digital image correlation. Mechanics of Advanced Materials and Structures, 0, 1–9, (Impact factor-3.60, Rank-9/34). https://doi.org/10.1080/15376494.2022.2084192
Wu C-M., Lin P-C., Kumar S., Chen J-C. (2022), Long-term open-hole tensile creep properties of self-reinforced PET composites measured by digital image correlation. Materials Chemistry and Physics, 278, 125633/1-125633/10, (SCI, Q2, Impact factor-4.70, Rank- 150/460). https://doi.org/10.1016/j.matchemphys.2021.125633
Kumar S., Wu C-M., Lai W-Y., Lin P-C. (2021), Pin hole tensile and fatigue properties of self-reinforced PET composites. Composite Structures, 255, 112981/1-112981/9, (SCI, Q1, Impact factor-7.310, Rank-8/171)https://doi.org/10.1016/j.compstruct.2020.112981
M.S./Ph.D. Integrated Students · 석박사통합과정 14
Se-Min Lee이세민
M.S./Ph.D. Student · 2021.03 – Present
Seed-layer adhesion for fine-pitch packaging; reliability of automotive power modules (FET) and crash simulation
Journal papers · 논문 7
Hui-Jin Um, Se-Min Lee, Dae-Woong Lee, Sangyul Ha and Hak-Sung Kim, “Mixed mode fracture toughness of epoxy molding compound/printed circuit board interface of semiconductor packages with respect to temperature and moisture”, Composite Structures, 2023
Se-Min Lee, In-Soo Han, Gyu-Won Kim, Jae-Hyun An and Hak-Sung Kim, “Accuracy enhancement for airbag deployment simulations considering the strain rate and temperature-dependent mechanical properties of thermoplastic olefin and polypropylene”, Composites Part B: Engineering, 2024
Se-Min Lee, Jeong-Hyeon Baek, Myeong-Hyeon Yu, Seong-Wook Jeon, Woo-Seok Choi, Sung-Pil Heo, Moon-Ho Yang, Jun-Hong Park and Hak-Sung Kim, “Multi-scale (Macro-Meso-Micro) Progressive Failure Simulation of the Carbon Fiber Braided Structure Under Quasi-static Mechanical Loading”, International Journal of Precision Engineering and Manufacturing-Green Technology, 2024
Young-Min Ju, Dukyong Kim, Se-Min Lee, Heuisu Kim, Daewoong Lee, Yeon-Taek Hwang, Seung Hwan Lee and Hak-Sung Kim, “Measurement of interfacial adhesion strength of Copper-Silicon based dielectric interfaces via laser spallation test”, Applied Surface Science Advances, 2025
Se-Min Lee, Hui-Jin Um , Na-Hyun Jeon, Hyun-Ji Rho, Soon-Oh Jeong, Young-Ju Han, Moo-Seong Kim and Hak-Sung Kim, “Dry plasma-enhanced adhesion of Ti/Cu seed layers to ABF substrates for fine-pitch packaging reliability”, Applied Surface Science, 2026
Young-Woo Kim, Jeong-Hyeon Baek, Se-Min Lee, Jong-Whi Park, Ho-Jin Lee, Tae-Hoon Kim, Ji-Hye Shim, Hong-Yun So and Hak-Sung Kim, “Integrated electrochemical characterization and finite element modeling for optimizing copper filling in through-glass Vias: Kinetic parameter extraction and profile prediction”, Journal of Electroanalytical Chemistry, 2026
Gyu-won Kim, Se-Min Lee, Hyun-Ji Rho, Jae-Hyun An and Hak-Sung Kim, “Deep Neural Network Methodology for Predicting and Visualizing Passenger Airbag Deployment Dynamics: Toward Industrial Implementation”, Engineering Applications of Artificial Intelligence, (Under review)
Conferences · 학회 발표 15
“Study of the compressive behavior of polypropylene-low glass fiber compound and thermoplastic olefin under high strain rate”, 대한기계학회 춘계학술대회, Jun 2021
“브레이딩 탄소섬유강화 복합재의 Multi-scale 기반 기계적 물성 예측”, 한국복합재료학회 춘계학술대회, May 2022
“Study on the effect of strain rate and temperature on the mechanical behavior of polypropylene – glass fiber compound and thermoplastic olefin”, The 20th European Conference on Composite Materials (ECCM20), Jun 2022
“High strain rate dynamic tensile behavior of chopped glass fiber polypropylene composite at high and low temperatures”, 25th International Conference on Composite Structures (ICCS 25), Jul 2022
“Study on the mixed mode delamination of epoxy mold compound (EMC)/printed circuit board (PCB) interface considering various temperature and moisture absorption”, International Symposium on Microelectronics and Packaging (ISMP), Nov 2022
“Prediction of delamination at interface of printed circuit board/epoxy molding compound under mixed-mode loading”, IEEE Electron Devices Technology and Manufacturing (EDTM) Conference 2023, Mar 2023
“Laser spallation test for measurement of the interfacial adhesion of thin films”, The 21st International Symposium on Microelectronics and Packaging (ISMP 2023), Oct 2023
“폴리머의 변형률 속도와 온도에 따른 기계적 특성을 고려한 에어백 전개 시뮬레이션의 정확도 향상”, 대한기계학회 추계학술대회, Nov 2023
“DNN 회귀를 이용한 딥러닝 기반 에어백 전개 예측”, 한국복합재료학회 추계학술대회, Nov 2023
“레이저 파쇄 기술을 이용한 박막 계면 물성 측정”, 한국마이크로전자 및 패키징학회 정기학술대회 (KMEPS), Apr 2024
“Measurement of the interfacial properties of metal thin-film by laser spallation test”, IEEE Electronic Components and Technology Conference (ECTC 2024), May 2024
“시드층 접착력 향상을 위한 플라즈마 처리 및 박막 두께 최적화”, 한국복합재료학회 춘계학술대회, Apr–May 2025
“DNN 회귀를 이용한 딥러닝 기반 에어백 전개 예측”, 대한기계학회 재료 및 파괴부문 춘계학술대회, Jun 2025
“Reliability Prediction of Automotive SiC MOSFET Packages Based on Degradation of EMC Viscoelasticity and Interfacial Strength”, IEEE 76th Electronic Components and Technology Conference (ECTC 2026), May 2026
“열가소성 올레핀 및 폴리프로필렌의 변형률 속도 및 온도 의존 기계적 물성을 고려한 에어백 전개 시뮬레이션 정확도 향상”, 대한기계학회 재료 및 파괴부문 춘계학술대회, Jun 2026
Patents · 특허 6
김학성, 이세민,김덕중,김상일, “인공신경망을 이용한 건축 구조물의 열특성 산출 방법 및 장치”, 국내특허등록, 10-2773479, 2025.02.21.
김학성, 이세민,김상일,김규원,한영구, “인공신경망을 이용한 창세트 정보 자동 산출 방법 및 장치”, 국내특허등록, 10-2841213, 2025.07.28.
김학성, 이세민,김헌수,김상일,김태완, “테라헤르츠파를 이용한 금속 박막 검사 장치 및 방법”, 국내특허출원, 10-2024-0102113, 2024.10.10.
김학성, 이세민,엄희진,전나현,노현지, “회로 기판 및 이를 포함하는 반도체 패키지”, 국내특허출원, 10-2025-0186787, 2025.12.01.
김학성, 이세민,유웅규,김영우,박종휘,한희주,” 반도체용 기판 및 그 제조 방법”, 국내특허출원, 10-2025-0199590, 2025.12.15.
김학성, 이세민,김덕중,김상일, “METHOD AND DEVICE FOR CALCULATING THERMAL CHARACTERISTICS OF BUILDING STRUCTURE USING ARTIFICIAL NEURAL NETWORK”, US 특허등록, 12,524,669, 2026.01.13.
Awards · 수상 3
DNN 회귀를 이용한 딥러닝 기반 에어백 전개 예측, 2023 한국복합재료학회 추계학술대회, 최우수발표논문상
폴리머의 변형률 속도와 온도에 따른 기계적 특성을 고려한 에어백 전개 시뮬레이션의 정확도 향상, 2023 대한기계학회 학술대회, 우수학생논문상
열가소성 올레핀과 폴리프로필렌 소재의 변형률 속도와 온도에 따른 기계적 특성을 고려한 에어백 전개 시뮬레이션의 정확도 향상, 2024 한국복합재료학회 춘계학술대회, 최우수발표논문상
You-Gwon Kim김유권
M.S./Ph.D. Student · 2021.09 – Present
Hybrid / fluxless bonding processes and solder-joint reliability
Journal papers · 논문 8
Park, J. W., Ju, Y. M., Kim, Y. G., & Kim, H. S. (2023). 50% reduction in energy consumption in an actual cold storage facility using a deep reinforcement learning-based control algorithm. Applied Energy, 352, 121996.
Kim, H. S., Kim, Y. G., Jang, D. M., Jang, J. W., Lee, S. Y., & Kim, H. S. (2025). Prediction of fatigue life of semiconductor package under thermal cycling: Combined effect of package design and solder materials. Materials & Design, 254, 114059.
Kim, H. S., Kim, S. I., Kim, Y. G., Park, D. W., & Kim, H. S. (2025). Detection of hidden defects inside polymer tubes using anomaly detection with generative adversarial neural network based on terahertz scanning images. Journal of Infrared, Millimeter, and Terahertz Waves, 46(1), 4.
Kim, You-Gwon, et al. “Synergistic role of Bi, Ni, and Pd alloying in SAC305 for enhanced IMC suppression and superior thermo-mechanical performance.” Journal of Materials Research and Technology (2025).
Jang, Y., Kim, Y. G., Kim, H. S., Kim, D. H., Jang, D. M., Jang, J. W., ... & Han, B. (2025). Determination of fatigue model constants for bi-based sac305 hybrid solder joint. IEEE Transactions on Components, Packaging and Manufacturing Technology, 15(10), 2152-2159.
You-Gwon Kim, Dong-Hoon Yoo, Hyeong-Bin Park, Min Seo and Hak-Sung Kim, “A Unified Approach for Characterizing Fatigue Parameters of SAC305 Solder Joints using a Multi-DNP Specimen under Thermal Cycling”, Journal of Materials Research and Technology, (Under review)
You-Gwon Kim, Dong-Hoon Yoo, Hyeong-Bin Park, Jong-Whi Park and Hak-Sung Kim, “Unraveling the Mechanism of UV-Assisted Fluxless Solder Bonding: Surface Oxide Modification and In-Situ Mechanical-Electrical Monitoring”, Advanced Science, (Under review).
Hyeong-bin Park, You-Gwon Kim, Jin-Young Bang, Jong-Bum Lee, and Hak-Sung Kim, “Distance from Neutral Point (DNP)–Induced Strain Gradients for Efficient Strain–Life Fatigue Evaluation of Solder Joints under Cyclic Four-Point Bending”, International Journal of Precision Engineering and Manufacturing-Green Technology, 2026
Conferences · 학회 발표 13
You-Gwon Kim, Dong Woon Park and Hak Sung Kim, “Measurement of electrical conductivity of multi-walled carbon nanotube/epoxy composites using terahertz time-domain spectroscopy”, 한국비파괴검사학회 춘계학술대회 2022(Presentation)
You-Gwon Kim, Dong-Woon Park, Heon-Su Kim, Sang-Il Kim, and Hak-Sung Kim, “Analysis of defects inside ceramic, polymer and metal composites using terahertz wave”, 한국비파괴검사학회 추계학술대회 2022 (Presentation).
You-Gwon Kim, Heon-Su Kim, Jin-Woo Jang, Seung-Yeong Lee, Hak-Sung Kim, “Prediction of crack type and fatigue life of printed circuit board with respect to solder composition under repeated thermal cycle”, ISMP2022, 2022 (Presentation)
You-Gwon Kim, Heon-Su Kim, Jin-Woo Jang, Seung-Yeong Lee, Hak-Sung Kim, “Prediction of thermal fatigue life of printed circuit boards with respect to solder type under repeated thermal cycle”. KISM2022, 2022 (Presentation)
You-Gwon Kim, Heon-Su Kim, Sang-Il Kim and Hak-Sung Kim, “3D-mapping of delamination in glass fiber reinforced polymer based on terahertz time-domain spectroscopy system” NEMS2023, 2023 (Presentation)
You-Gwon Kim, Sang-Il Kim, Heon-Su Kim and Hak-Sung Kim, “Inspection of defect inside ceramic, polymer, and metal composites using deep learning-based terahertz signal training” 한국비파괴검사학회 춘계학술대회 2023 (Presentation).
You-Gwon Kim, Heon-Su Kim, Tae-Wan Kim, Seong-Ung Ryu, and Hak-Sung Kim, “Enhancing Solder Joint Reliability through advanced solder with Bi, Ni, and Pd: A Comparative Study of Creep properties, IMC Suppression, and Mechanical Properties.” 대한기계학회 재료 및 파괴부분 춘계학술대회, 2024 (Presentation)
You-Gwon Kim, Heon-Su Kim, Tae-Wan Kim, Jin-Gyu Kim, and Hak-Sung Kim, “Improving Solder Joint Reliability with Bi, Ni, and Pd-Modified Alloys: A Comparative Analysis of Creep Performance, IMC Suppression, and Mechanical Properties” KISM2024, 2024 (Presentation)
You-Gwon Kim, Hyeong-Bin Park, Dong-Hoon Yoo, and Hak-Sung Kim, “Advancing Solder Joint Reliability with Bi–Ni–Pd Modified SAC Alloys: Insights into Creep Behavior, Interfacial Stability, and Joint Strength”, 대한기계학회 재료 및 파괴부분 춘계학술대회, 2025 (Presentation)
You-Gwon Kim, Dong Woon Park and Hak Sung Kim, “Study on predicting electrical conductivity and percolation threshold of multi-walled carbon nanotube/epoxy composites using terahertz time domain spectroscopy”, ECCM20, 2022 (Presentation)
You-Gwon Kim, Heon-Su Kim, Tae-Wan Kim, Seong-Ung Ryu, Hak-Sung Kim, Yongrae Jang, Bongtae Han, Jun-Hyeong Lee, Jin-Kyu Kim, “Preparation of SAC305 Solder Specimens that mimic the Microstructures of a Micro Solder Ball” IEEE 74th Electronic Components and Technology Conference (ECTC), 2024 (Presentation)
You-Gwon Kim, Dong-Hoon Yoo, Hyeong-Bin Park, Jong-Whi Park, Seung-Chul Shin, Dong-Suk Kang, Hak-Sung Kim, “UV-Assisted Fluxless Bonding for Advanced Packaging: Interfacial Mechanisms and Reliability Assessment”, The 27th Electronics Packaging Technology Conference (EPTC 2025), Dec 2025 (Presentation)
You-Gwon Kim, Dong-Hoon Yoo, Hyeong-Bin Park, Jong-Whi Park, Seung-Chul Shin, Dong-Suk Kang, Hak-Sung Kim, “Simplified Fluxless Bonding via Ultraviolet Activation: Enabling High-Reliability Fine-Pitch Interconnections”, IEEE 76th Electronic Components and Technology Conference (ECTC), 2026 (Presentation)
Patents · 특허 7
김학성, 김유권, 박종휘, 박형빈, 유동훈, “UV 동시 조사를 통한 플럭스리스 접합 공정 기술”, 국내특허출원, 10-2025-0070234, 2025.05.29.
김학성, 김유권, 박종휘, 박형빈, 유동훈, “Advanced flux-less bonding process based on simultaneous ultraviolet irradiation”, PCT 출원, PCT/KR2025/009209, 2025.06.30.
김학성, 김상일, 김태완, 전민우, 염재민, 김유권, 유동훈, 박형빈, “테라헤르츠파를 이용한 하이브리드 본딩 공정 모니터링 장치 및 방법”, 국내특허출원, 10-2026-0082336, 2026.05.07.
김학성, 김상일, 김태완, 전민우, 김유권, 박형빈, 유동훈, “LIT를 이용한 하이브리드 본딩 검사 장치 및 방법”, 국내특허출원, 10-2026-0085352, 2026.05.12.
김학성, 김상일, 김태완, 전민우, 김유권, 유동훈, 박형빈 “Systems and Methods for Real-Time Hybrid Bonding Process Monitoring via Terahertz Waves”, PCT 출원, PCT/KR2026/013064, 2026.09.02.
김학성, 박종휘, 주영민, 김유권 “인공지능 기반 냉난방기 온도 제어 알고리즘 및 그 방법”, 국내특허출원, 10-2023-0059034, May 08th 2023
김학성, 김상일, 김유권 “테라헤르츠 파를 이용한 폴리머 경화도 모니터링 장치 및 방법”, 국내특허등록, 10-2898049, December 04th 2025
Awards · 수상 1
IEEE Electronic Components and Technology Conference (ECTC) 2026, Student travel grant award (Simplified Fluxless Bonding via Ultraviolet Activation: Enabling High-Reliability Fine-Pitch Interconnections)
Gyu-Won Kim김규원
M.S./Ph.D. Student · 2022.03 – Present
Package thermal management (cold plates, heat-dissipation) and composite structures
Journal papers · 논문 3
“Prediction of stress-strain behavior of carbon fabric woven composites by deep neural network”, Dug-Joong Kim, Gyu-Won Kim, Jeong-Hyeon Baek, Byeunggun Nam, and Hak-Sung Kim (Composite Structures)
“Accuracy enhancement for airbag deployment simulations considering the strain rate and temperature-dependent mechanical properties of thermoplastic olefin and polypropylene”, Se-Min Lee, In-Soo Han, Gyu-Won Kim, Jae-Hyun An, and Hak-Sung Kim (Composites Part B: Engineering)
“Development of the modified V-notched rail shear test for carbon fiber reinforced composites with multi-scale simulation method considering microscopic failure points”, Gyu-Won Kim, Hyun-Ji Rho, Young-Woo Kim, Jun-Seop Song, Woe Tae Kim, Dong-Hwi Kim, Jong-Whi Park, and Hak-Sung Kim (Composites Part A: Applied Science and Manufacturing)
Conferences · 학회 발표 14
“멀티스케일 해석을 통한 탄소섬유강화 직조 복합재의 응력-변형률 선도의 예측”, Gyu-Won Kim, Dug-Joong Kim, Jeong-Hyeon Baek, and Hak-Sung Kim (2022 한국복합재료학회 춘계학술대회/Oral)
“Prediction of stress-strain curves of woven carbon fiber reinforced plastics composite through multi-scale analysis”, Gyu-Won Kim, Dug-Joong Kim, Jeong-Hyeon Baek, and Hak-Sung Kim (ECCM 20/Oral)
“멀티스케일 해석을 통한 탄소섬유강화 직조 복합재의 응력-변형률 선도의 예측”, Gyu-Won Kim, Dug-Joong Kim, Jeong-Hyeon Baek, and Hak-Sung Kim (2023 대한기계학회 추계학술대회, Oral)
“심층신경망을 통한 탄소섬유강화 직조 복합재의 응력-변형률 선도의 예측”, Gyu-Won Kim, Dug-Joong Kim, Jeong-Hyeon Baek, and Hak-Sung Kim (2023 한국복합재료학회 추계학술대회/Oral)
“미시적 파괴지점을 고려한 멀티스케일 해석을 통한 단방향 탄소섬유강화 복합재의 기계적 거동 예측”, Gyu-Won Kim, Hyun-Ji Rho, Young-Woo Kim, and Hak-Sung Kim (2024 한국복합재료학회 춘계학술대회/Oral)
“Prediction of the mechanical behavior of Passenger airbag module by design factors based on Deep Neural Networks”, Gyu-Won Kim, Se-Min Lee, Hyun-Ji Rho, Jae-Hyun An, and Hak-Sung Kim (ECCM 21/Oral)
“심층신경망 기반 설계 인자에 따른 조수석 에어백 모듈의 기계적 거동 예측”, Gyu-Won Kim, Se-Min Lee, Hyun-Ji Rho, Jae-Hyun An, and Hak-Sung Kim (2024 대한기계학회 추계학술대회/Oral)
“탄소섬유강화 복합재의 순수 전단 시험 장치 및 미시적 파괴 지점을 고려한 멀티스케일 해석 기법 개발”, Gyu-Won Kim, Hyun-Ji Rho, Young-Woo Kim, Jun-Seop Song, Woe-Tae Kim, Dong-Hwi Kim, and Hak-Sung Kim (2025 대한기계학회 재료및파괴부문 춘계학술대회/Oral)
“탄소섬유강화 복합재의 순수 전단 시험 장치 및 미시적 파괴 지점을 고려한 멀티스케일 해석 기법 개발”, Gyu-Won Kim, Hyun-Ji Rho, Young-Woo Kim, Jun-Seop Song, Woe-Tae Kim, Dong-Hwi Kim, Ji-Hwan Shin, and Hak-Sung Kim (2025 한국군사과학기술학회 종합학술대회/Oral)
“탄소섬유강화 복합재의 순수 전단 시험 장치 및 미시적 파괴 지점을 고려한 멀티스케일 해석 기법 개발”, Gyu-Won Kim, Hyun-Ji Rho, Young-Woo Kim, Jun-Seop Song, Woe-Tae Kim, Dong-Hwi Kim, and Hak-Sung Kim (2025 한국복합재료학회 추계학술대회/Oral)
“탄소섬유강화 복합재의 순수 전단 시험 장치 및 미시적 파괴 지점을 고려한 멀티스케일 해석 기법 개발”, Gyu-Won Kim, Hyun-Ji Rho, Young-Woo Kim, Jun-Seop Song, Woe-Tae Kim, Dong-Hwi Kim, and Hak-Sung Kim (2025 대한기계학회 재료및파괴부문 춘계학술대회/Oral)
“탄소섬유강화 복합재의 순수 전단 시험 장치 및 미시적 파괴 지점을 고려한 멀티스케일 해석 기법 개발”, Gyu-Won Kim, Hyun-Ji Rho, Young-Woo Kim, Jun-Seop Song, Woe-Tae Kim, Dong-Hwi Kim, Ji-Hwan Shin, and Hak-Sung Kim (2025 한국해군과학기술학회 동계학술대회/Oral)
“Finite Element Analysis Based Design Optimization of Heat Path Block Bonding Solder Hybrid Model in Semiconductor Packages”, Gyu-Won Kim, Jin-Gyu Kim, Han-Byoel Moon, and Hak-Sung Kim (2026 한국반도체디스플레이기술학회 국내학술대회/Poster)
“Prediction of thermal bridge of building structures based on physics-informed neural networks with universal structure model”, Gyu-Won Kim, Sang-Il Kim, Se-Min Lee, and Hak-Sung Kim (2026 대한기계학회 재료 및 파괴부문 춘계학술대회/Oral)
Patents · 특허 5
“객체탐지 딥러닝 알고리즘을 이용한 건물 창세트 자동 치수 측정 및 광특성 계산에 관한 방법” 김학성, 김상일, 이세민, 김규원, 한영구 (등록)
“METHOD AND DEVICE FOR AUTOMATICALLY CALCULATING WINDOW SET INFORMATION USING ARTIFICIAL NEURAL NETWORK” 김학성, 김규원, 김상일, 이세민, 한영구 (출원)
“METHOD AND DEVICE FOR AUTOMATICALLY CALCU USING ARTIFICIAL NEURAL NETWORK” 김학성, 김상일, 이세민, 김규원, 한영구 (출원)
“반도체 패키지의 스트레인 제어장치 및 이를 포함하는 반도체 패키지” 김학성, 소홍윤, 김규원, 박형빈(출원)
Awards · 수상 2
멀티스케일 해석을 통한 탄소섬유강화 직조 복합재의 응력-변형률 선도의 예측, 2022 한국복합재료학회 춘계학술대회, 우수논문발표상
탄소섬유강화 복합재의 순수 전단 시험 장치 및 미시적 파괴 지점을 고려한 멀티스케일 해석 기법 개발, 2025 한국복합재료학회 추계학술대회, 우수논문발표상
Woong-Kyoo Yoo유웅규
M.S./Ph.D. Student · 2023.03 – Present
Warpage modeling of PCB / RDL and 3D multi-die packages
Journal papers · 논문 5
Woong-Kyoo Yoo, Jeong-Hyeon Baek, Jong-Whi Park, Sanjay Kumar, Hak-Sung Kim “Rapid PCB warpage modeling through automated copper pattern classification and classical lamination Theory–Driven anisotropic viscoelastic homogenization”, Composites Part A: Applied Science and Manufacturing.
Jeong-Hyeon Baek, Woong-Kyoo Yoo, Woo-Jin An, Jun-Seop Song, Gyung-Hwan Oh, Ji-Hye Shim, Hak-Sung Kim, “Process-integrated in-situ characterization and multiscale modeling of cure-dependent thermo-mechanical behavior of epoxy molding compounds for accurate warpage prediction in advanced semiconductor packaging” , Materials Today Advances.
Sanjay Kumar, Woong-Kyoo Yoo, Jaesung Kim, Chae-Young Ahn, Jinwoong Kim, Chan Hyuk Park, Hak-Sung Kim, “Anisotropic viscoelastic properties of prepreg and their influence on warpage of thin PCB substrates”, Composites Part A: Applied Science and Manufacturing.
Jeong-Hyeon Baek, Jun-Seop Song, Woong-Kyoo Yoo, Woo-Jin An, Gyung-Hwan Oh, Hak-Sung Kim, “Multi-physics coupled modeling of process-induced warpage in advanced fan-out wafer-level semiconductor packages”, Journal of Manufacturing Processes.
Woong-Kyoo Yoo, Sanjay Kumar, Jaesung Kim, Chaeyoung Ahn, Jinwoong Kim, Chan-Hyuk Park, and Hak-Sung Kim, “Process-History-Dependent Warpage Evolution in Advanced Semiconductor Substrates Role of Cu-Clad Laminate”, International Journal of Mechanical Sciences (Under Review).
Conferences · 학회 발표 11
유웅규, 백정현, 박종휘, 김학성, “상 •하부 대칭 구조를 활용한 워피지 프리 패키지 구조Double-sided Warpage free Package Structure” 2023 KMEPS
유웅규, 백정현,· 박종휘, 류한성, 오경환, 김학성, “Fiber Bragg grating 센서 및 dielectric 센서를 이용한 경화 공정에 따른 epoxy molding compound의 기계적 거동에 관한 연구” 2023 KSME
유웅규, 백정현,· 박종휘, 류한성, 오경환, 김학성, “Study on the mechanical behavior of epoxy molding compound according to curing conditions using Fiber Bragg grating sensor and dielectric sensor” 2023 KSCM
Woong-Kyoo Yoo, Jeong-Hyeon Baek, and Hak-Sung Kim, “Automatic Pattern Classification-based Prediction of Warpage in Complex Patterned Semiconductor Packages Considering The Anisotropic Viscoelastic Properties” 2024 ISMP
Woong-Kyoo Yoo, Jeong-Hyeon Baek and Hak-Sung Kim, “Automatic Pattern Classification-based Prediction of Warpage in Complex Semiconductor Packages Considering The Anisotropic Viscoelastic Properties” 2024 KISM
유웅규, 백정현, 김학성, “이방성 점탄성 고려 등가모델을 활용한 반도체 패키지의 워피지 예측” 2024 KMEPS
Woong-Kyoo Yoo, Jun-Seop Song, Hyung-mo Koo, Hak-Sung Kim, “Prediction of the warpage for large-scale semiconductor package using equivalent model considering the anisotropic thermomechanical properties based on multi-physics simulation” 2025 ISMP
유웅규, 백정현, 김학성, “다중 물리 시뮬레이션 기반 이방성 열-기계적 특성을 고려한 등가모델링 활용 대면적 반도체 패키지의 워피지 예측” 2025 KMEPS
유웅규, 백정현 , 박종휘 ,김학성, “다중 물리 시뮬레이션 기반 이방성 열-기계적 특성을 고려한 등가모델링 활용 대면적 반도체 패키지의 워피지 예측” 2025 KSCM
유웅규,· Sanjay Kumar,· 김재성,· 안채영, 김진웅,· 박찬혁, 김학성, “첨단반도체 패키지 기판의 다중 공정에 따른 열기계적 거동 분석” 2026 KSME
유웅규, 백정현, 박종휘, 김학성, “다중 물리 시뮬레이션 기반 이방성 열-기계적 특성을 고려한 등가모델링 활용 대면적 반도체 패키지의 워피지 예측” 2026 KSDT
Patents · 특허 2
김학성, 이세민,유웅규,김영우,박종휘,한희주,” 반도체용 기판 및 그 제조 방법”, 국내특허출원, 10-2025-0199590, 2025.12.15.
김학성, 박종휘, 백정현, 유웅규, “반도체 패키지 및 그 제조방법”, 국내특허등록, 10-2838266, 2025.07.21
Tae-Wan Kim김태완
M.S./Ph.D. Student · 2023.03 – Present
Terahertz non-destructive evaluation for semiconductor processes (stealth dicing, polymer degradation)
Journal papers · 논문 5
“Non-destructive evaluation of thermally induced structural transformation in PET using terahertz time-domain spectroscopy”, Tae-Wan Kim, Sang-Il Kim, Heon-Su Kim, Chang-Jin Moon, and Hak-Sung Kim (Materials Today Advances, (2026), 29, 100732)
“Synergistic Role of Bi, Ni, and Pd Alloying in SAC305 for Enhanced IMC Suppression and Superior Thermo-Mechanical Performance”, You-Gwon Kim, Heon-Su Kim, Tae-Wan Kim, Hyeong-Bin Park, Jong-Whi Park, Yongrae Jang, Bongtae Han, Jun-Hyeong Lee, Jin Gyu Kim, Hak-Sung Kim (Journal of Materials Research and Technology, (2025), 38)
“In-situ inspection of stealth laser diced internal crack lines in silicon wafer using cepstrum signal processing with terahertz electro-magnetic wave”, Sang-Il Kim, Heon-Su Kim, Tae-Wan Kim, Jin-Sang Lim, Dong-Su Han, Hae-Gu Lee, and Hak-Sung Kim (Measurement. (2025), 262)
“Advanced WBG Power Semiconductor Packaging: Nanomaterials and Nanotechnologies for High-Performance Die Attach Paste”, Young-Min Ju, Tae-Wan Kim, Seung-Hyun Lee, Ho-Jin Lee, Jinho Ahn, Hak-Sung Kim (Nano Convergence, (2025), 12, 38)
“A Dual-Band Terahertz Analysis Approach for Concurrent Measurement of Battery Separator Thickness and Porosity”, Sang-Il Kim, Tae-Wan Kim, Min-Woo Jeon, Heon-Su Kim, and Hak-Sung Kim (Journal of Energy Storage, 2026)
Conferences · 학회 발표 9
“딥러닝 기반 테라헤르츠 검사 기술을 사용한 세라믹, 폴리머, 금속 복합체 내부 결함 검사”, 김태완, 김상일, 김유권, 김헌수, 김학성 (2023 대한기계학회 재료 및 파괴부문 춘계학술대회, Jun 2023 / Presentation)
“테라헤르츠파를 사용한 실시간 폴리머 열화 검사 기술에 관한 연구”, 김태완, 김상일, 김헌수, 김학성 (2024 한국비파괴검사학회 추계학술대회, Nov 2024 / Presentation)
“테라헤르츠파를 사용한 실시간 폴리머 열화 검사 기술에 관한 연구”, 김태완, 김상일, 정현진, 김헌수, 김학성 (2025 한국복합재료학회 춘계학술대회, May 2025 / Presentation)
“테라헤르츠파를 사용한 실시간 폴리머 열화 검사 기술에 관한 연구”, 김태완, 김상일, 김헌수, 김학성 (2025 한국비파괴검사학회 추계학술대회, Nov 2025 / Presentation)
“테라헤르츠파를 사용한 실리콘 웨이퍼 내부 스텔스 다이싱 라인 검사 기술에 관한 연구”, 김태완, 김상일, 김헌수, 임진상, 한동수, 이해구, 김학성 (2026 한국비파괴검사학회 춘계학술대회, May 2026 / Presentation)
“테라헤르츠 전자기파를 이용한 캡스트럼 신호처리 기반 실리콘 웨이퍼 내 스텔스 레이저 다이싱 라인 비파괴검사”, 김태완, 김상일, 김헌수, 임진상, 한동수, 이해구, 김학성 (2026 대한기계학회 재료 및 파괴부문 춘계학술대회, Jun 2026 / Presentation)
“Deep learning-based terahertz inspection technique for internal defect detection in ceramic, polymer, and metal composites used in semiconductor manufacturing process”, Tae-Wan Kim, Sang-Il Kim, You-Gwon Kim, Heon-Su Kim, and Hak-Sung Kim (The 21st International Symposium on Microelectronics and Packaging [ISMP 2023], Oct 2023 / Presentation)
“Deep learning-based terahertz inspection technique for internal defect detection in ceramic, polymer, and metal composites”, Tae-Wan Kim, Sang-Il Kim, You-Gwon Kim, Heon-Su Kim, and Hak-Sung Kim (2023 MRS(Material Research Society) Fall Meeting & Exhibit, Nov 2023 / Poster)
“Non-destructive evaluation of polymer pipe degradation using terahertz inspection techniques”, Tae-Wan Kim, Sang-Il Kim, Heon-Su Kim, and Hak-Sung Kim (2024 WCNDT(World Conference on Non-Destructive Testing), May 2024 / Presentation)
Patents · 특허 11
“테라헤르츠파를 이용한 배터리 분리막 품질 검사 장치 및 방법”, 김학성, 김헌수, 김상일, 김태완 (출원 / 10-2024-0027881,2024. 02. 27)
“테라헤르츠 파를 이용한 금속 박막 검사 장치 및 방법”, 김학성, 김상일, 김헌수, 이세민, 김태완 (출원 / 10-2024-0137973, 2024. 10.10)
“테라헤르츠파를 이용한 반도체 기판 검사 장치 및 방법”, 김학성, 김상일, 김태완, 전민우, 정현진 (출원 / 10-2025-0096335, 2025. 07. 16)
“테라헤르츠파를 이용한 진공 밀폐 부재의 상태 모니터링 장치 및 방법”, 김학성, 김상일, 김태완, 전민우 (출원 / 10-2025-0091458, 2025.07.08)
“테라헤르츠 파를 이용한 미세 결함 검사 장치 및 방법”, 김학성, 김헌수, 김상일, 김태완, 이해구, 한동수, 임진상 (출원 / 10-2025-0122662, 2025.08.29)
“테라헤르츠파를 이용한 하이브리드 본딩 공정 모니터링 장치 및 방법”, 김학성, 김상일, 김태완, 전민우, 김유권, 유동훈, 박형빈 (출원 / 10-2026-0082336, 2026.05.07)
“LIT를 이용한 하이브리드 본딩 검사 장치 및 방법”, 김학성, 김상일, 김태완, 전민우, 염재민, 김유권, 유동훈, 박형빈 (출원 / 10-2026-0085352, 2026.05.12)
LIT를 이용한 반도체용 기판 구조체 검사 장치 및 방법", 김학성, 김태완, 전민우, 염재민, 이혜은 (출원 / 10-2026-0205268, 2026.10.22)
“Apparatus and Method for Metal Thin Film Inspection Using Terahertz Waves” (PCT 출원 / 김학성, 김상일, 김헌수, 김태완, 이세민, PCT/KR2025/011430, 2025.07.31)
“Systems and Methods for Real-Time Hybrid Bonding Process Monitoring via Terahertz Waves” (PCT 출원 / 김학성, 김상일, 김태완, 전민우, 김유권, 유동훈, 박형빈, PCT/KR2026/013064, 2026.09.02)
Awards · 수상 1
우수논문발표상, “테라헤르츠파를 사용한 실시간 폴리머 열화 검사 기술에 관한 연구”, 2025 한국비파괴검사학회 추계학술대회, 2025.11
Dong-Hoon Yoo유동훈
M.S./Ph.D. Student · 2024.09 – Present
Board-level drop reliability, solder-joint thermal-cycling life and hybrid/fluxless bonding
Journal papers · 논문 3
Sanjay Kumar, Dong-Hoon Yoo, Jun-Seop Song and Hak-Sung Kim, “Effect of geometric configurations and heat treatment on the tensile properties, joint performance, and failure behavior of 3D-Printed carbon and glass fiber composites”, Composites Part B: Engineering, 2025
Sanjay Kumar, Dong-Hoon Yoo, Jun-Seop Song and Hak-Sung Kim, “A critical review of the past, present, and future of 3D printing for continuous and short fiber composites”, Composite Structures, 2025
You-Gwon Kim, Dong-Hoon Yoo, Hyeong-Bin Park, Min Seo and Hak-Sung Kim, “A Unified Approach for Characterizing Fatigue Parameters of SAC305 Solder Joints using a Multi-DNP Specimen under Thermal Cycling”, Journal of Materials Research and Technology, (Under review)
Conferences · 학회 발표 6
“Improved drop impact reliability prediction of SAC Solder by incorporating high strain rate and high temperature mechanical properties”, 대한기계학회 재료 및 파괴부문 춘계학술대회, Jun 2025
“Drop impact reliability of SAC Solder: Insights from high strain-rate and elevated-temperature behavior”, International Symposium on Microelectronics and Packaging (ISMP 2025), Sep 2025
“Integrated Optimization of Plasma Activation and Bonding Conditions for SiO2-Cu Hybrid Bonding”, KMEPS 2026년 정기학술대회, Apr 2025
“High-Fidelity Reliability Prediction of SAC Solder under Drop Impact via High Strain Rate and Temperature-Dependent Properties”, IEEE 76th Electronic Components and Technology Conference (ECTC 2026), May 2026
“Improved Drop Impact Reliability Prediction of SAC305 Solder Joints Incorporating High Strain-Rate Properties”, 대한기계학회 재료 및 파괴부문 춘계학술대회, Jun 2026
“Interfacial Fracture Characterization of SiO2- SiO2 Bonding with Respect to Plasma Properties and Process Parameters”, 대한기계학회 2026년 학술대회, Nov 2026
Patents · 특허 5
김학성, 박종휘, 박형빈, 김유권, 유동훈, “UV 동시 조사를 통한 플럭스리스 접합 공정 기술”, 국내특허출원, 10-2025-0070234, 2025.05.29.
김학성, 박종휘, 박형빈, 김유권, 유동훈, “Advanced flux-less bonding process based on simultaneous ultraviolet irradiation”, PCT 출원, PCT/KR2025/009209, 2025.06.30.
김학성, 김상일, 김태완, 전민우, 염재민, 김유권, 유동훈, 박형빈, “테라헤르츠파를 이용한 하이브리드 본딩 공정 모니터링 장치 및 방법”, 국내특허출원, 10-2026-0082336, 2026.05.07.
김학성, 김상일, 김태완, 전민우, 김유권, 박형빈, 유동훈, “LIT를 이용한 하이브리드 본딩 검사 장치 및 방법”, 국내특허출원, 10-2026-0085352, 2026.05.12.
김학성, 김상일, 김태완, 전민우, 김유권, 유동훈, 박형빈 “Systems and Methods for Real-Time Hybrid Bonding Process Monitoring via Terahertz Waves”, PCT 출원, PCT/KR2026/013064, 2026.09.02.
Awards · 수상 3
Drop impact reliability of SAC Solder: Insights from high strain-rate and elevated-temperature behavior, ISMP 2025, 우수논문상
Integrated Optimization of Plasma Activation and Bonding Conditions for SiO2-Cu Hybrid Bonding, KMEPS 2026년 정기학술대회, 우수논문발표상
High-Fidelity Reliability Prediction of SAC Solder under Drop Impact via High Strain Rate and Temperature-Dependent Properties, ECTC 2026, Student travel grant award
Hyeong-Bin Park박형빈
M.S./Ph.D. Student · 2025.03 – Present
Next-generation bonding, solder materials and package thermal management
Journal papers · 논문 6
You-Gwon Kim, Heon-Su Kim, Tae-Wan Kim, Hyeong-Bin Park, Jong-Whi Park, Yong-rae Jang, Bong-tae Han, Jun-Hyeong Lee, Jin Gyu Kim, and Hak-Sung Kim, “Synergistic role of Bi, Ni, and Pd alloying in SAC305 for enhanced IMC suppression and superior thermo-mechanical performance”, Journal of Materials Research and Technology, 2025
Young-Min Ju, Hyeong-Bin Park, Yun-Joong Kim, and Hak-Sung Kim, “Ultrafast intense pulsed light bonding process for multi-die stacked packages”, Materials & Design, 2026
Hyeong-bin Park, You-Gwon Kim, Jin-Young Bang, Jong-Bum Lee, and Hak-Sung Kim, “Distance from Neutral Point (DNP)–Induced Strain Gradients for Efficient Strain–Life Fatigue Evaluation of Solder Joints under Cyclic Four-Point Bending”, International Journal of Precision Engineering and Manufacturing-Green Technology, 2026
You-Gwon Kim, Dong-Hoon Yoo, Hyeong-bin Park, Min Seo, and Hak-Sung Kim, “A Unified Approach for Characterizing Fatigue Parameters of SAC305 Solder Joints using a Multi-DNP Specimen under Thermal Cycling”, (Submitted)
You-Gwon Kim, Dong-Hoon Yoo, Hyeong-bin Park, Jong-Whi Park and Hak-Sung Kim, “Unraveling the Mechanism of UV-Assisted Fluxless Solder Bonding: Surface Oxide Modification and In-Situ Mechanical-Electrical Monitoring”, (Submitted)
Hyeong-bin Park, Young-Min Ju, Yun-Joong Kim, and Hak-Sung Kim, “Failure mechanisms of flip-chip solder joints on OSP, ENIG, and ENEPIG finishes: Mitigating Ni3P-related interfacial fracture and thermal fatigue by millisecond intense pulsed light bonding”, (Submitted)
Conferences · 학회 발표 6
“Development of a Fatigue Life Prediction Model for SAC Solder Joints Considering Creep and Fatigue Behavior”, Hyeong-Bin Park, You-Gwon Kim and Hak-Sung Kim (대한기계학회 재료 및 파괴부문 춘계학술대회 Jun 2025/Oral)
“Thermal Fatigue Characterization of SAC305 Solder Joints via a DNP-Oriented Modified Test Vehicle”, Hyeong-Bin Park, You-Gwon Kim, Dong-Hoon Yoo, and Hak-Sung Kim (ISMP Nov 2025/Poster)
“A Modified Test Vehicle Incorporating DNP (Distance from Neutral Point) Induced Strain Gradients for Single-Specimen Fatigue Life Assessment of Solder Joints”, Hyeong-Bin Park, You-Gwon Kim, Jin-Young Bang, Jong-Bum Lee, and Hak-Sung Kim (EPTC Dec 2025/Oral)
“Reliability Evaluation of Intense Pulsed Light Flip-Chip Bonding with Various Surface Finishes”, Hyeong-Bin Park, Young-Min Ju, Yun-Joong Kim, and Hak-Sung Kim (ECTC May 2026/Poster)
“Enhanced Reliability of Flip-Chip Solder Joints via IPL Bonding and Surface Finish Optimization”, Hyeong-Bin Park, Young-Min Ju, Yun-Joong Kim, and Hak-Sung Kim (대한기계학회 재료 및 파괴부문 춘계학술대회 Jun 2026/Oral)
“Effects of PCB Surface Finishes on Interfacial Reactions and Thermomechanical Reliability of Intense-Pulsed-Light Flip-Chip Solder Joints”, Hyeong-Bin Park, Yun-Joong Kim, and Hak-Sung Kim (대한기계학회 Nov 2026/Oral)
Patents · 특허 6
김학성, 김유권, 박종휘, 박형빈, 유동훈, “UV 동시 조사를 통한 플럭스리스 접합 공정 기술”, 국내특허출원, 10-2025-0070234, 2024.07.01
김학성, 김유권, 박종휘, 박형빈, 유동훈, “Advanced flux-less bonding process based on simultaneous ultraviolet irradiation”, PCT/KR2025/0092, 2025.06.30
김학성, 김상일, 김태완, 전민우, 염재민, 김유권, 박형빈, 유동훈, “Lock-In Thermography (LIT)를 사용한 하이브리드 본딩 검사 기술”, 국내특허출원 10-2025-0133554, 2025.09.17
김학성, 소홍윤, 김규원, 박형빈 “방열블록 및 이를 포함하는 반도체 패키지” 국내특허출원, 10-2026-0008874, 2026.01.16
김학성, 김상일, 김태완, 전민우, 김유권, 박형빈, 유동훈, “Systems and Methods for Real-Time Hybrid Bonding Process Monitoring via Terahertz Waves” PCT/KR2026/013064, 2026.09.02
Jun-Seop Song송준섭
M.S./Ph.D. Student · 2025.03 – Present
Fracture strength of ultra-thin dies and physics-informed AI for package reliability
Journal papers · 논문 5
“Effect of geometric configurations and heat treatment on the tensile properties, joint performance, and failure behavior of 3D-Printed carbon and glass fiber composites”, Sanjay Kumar, Dong-Hoon Yoo, Jun-Seop Song, and Hak-Sung Kim (Composites Part B: Engineering)
“Development of the modified V-notched rail shear test for carbon fiber reinforced composites with multi-scale simulation method considering microscopic failure points”, Gyu-Won Kim, Hyun-Ji Rho, Young-Woo Kim, Jun-Seop Song, Woe Tae Kim, Dong-Hwi Kim, Jong-Whi Park, and Hak-Sung Kim, (Composites Part A: Applied Science and Manufacturing)
“A critical review of the past, present, and future of 3D printing for continuous and short fiber composites”, Sanjay Kumar, Dong-Hoon Yoo, Jun-Seop Song, and Hak-Sung Kim, (Composite Structures)
“Process-integrated in-situ characterization and multiscale modeling of cure-dependent thermo-mechanical behavior of epoxy molding compounds for accurate warpage prediction in advanced semiconductor packaging”, Jeong-Hyeon Baek, Woong-Kyoo Yoo, Woo-Jin An, Jun-Seop Song, Gyung-Hwan Oh, Ji-Hye Shim, and Hak-Sung Kim, (Materialstoday ADVANCES)
“Multi-physics coupled modeling of process-induced warpage in advanced fan-out wafer-level semiconductor packages”, Jeong-Hyeon Baek, Jun-Seop Song, Woong-Kyoo Yoo, Woo-Jin An, Gyung-Hwan Oh, and Hak-Sung Kim (Journal of Manufacturing Processes)
Conferences · 학회 발표 5
“A Study on the Strength Evaluation Methods of Ultra-Thin Dies Using Finite Element Analysis”, Jun-Seop Song, Sang-Il Kim, Gyu-Won Kim, Woong-Kyoo Yoo, Jong-Woon Yoo, and Hak-Sung Kim (KMEPS 2025/Poster)
“Fracture Strength Evaluation of Ultrathin Die Through FEM-Validated Three-Point Bending and Ball-on-Ring Tests”, Jun-Seop Song, Sang-Il Kim, Gyu-Won Kim, Woong-Kyoo Yoo, Jong-Woon Yoo, Sang-Hoon Ko, and Hak-Sung Kim (대한기계학회 재료 및 파괴부문 2025/Oral)
“FEA-Integrated 3PB And BOR Testing For Fracture Strength Characterization Of Ultra-thin Dies: Effects Of Thickness, Surface Conditions, And Anisotropy”, Jun-Seop Song, Sang-Il Kim, Gyu-Won Kim, Woong-Kyoo Yoo, Jong-Woon Yoo, Sang-Hoon Ko, and Hak-Sung Kim, (Electronic Components and Technology Conference 2026, Poster)
“Prediction of Warpage Behavior in Fan-Out Wafer Level Package Considering Manufacturing Process”, Jun-Seop Song, Ho-Jin Lee, Ji-Hye Shim, Jun-Hyeong Park, Tae-Hoon Kim, Ju-Yeob Lee, and Hak-Sung Kim (대한기계학회 재료 및 파괴부문 2026/Poster)
“Multiscale Characterization of EMC for Reliable Warpage Prediction Using In-Situ Monitoring and Molecular Dynamics Simulation”, Jun-Seop Song, Jeong-Hyeon Baek, Woong-Kyoo Yoo, Ji-Hye Shim, Gyung-Hwan Oh, and Hak-Sung Kim (International Symposium on Microelectronics Packaging 2026/Poster)
RDL reliability and electrochemical corrosion in advanced packages
Journal papers · 논문 2
“Corrosion lifetime prediction of electro-galvanized iron using potentiodynamic polarization and multiphysics simulation under different process and environmental conditions”, Se-Jun Park, Ho-Jin Lee, Sang-Il Kim, Kwang-Soon Kim, Jae-Seok Choi, Gab-Seong Lee, and Hak-Sung Kim (Corrosion Science, (2027), 274, 114382)
“Advanced WBG Power Semiconductor Packaging: Nanomaterials and Nanotechnologies for High-Performance Die Attach Paste”, Young-Min Ju, Tae-Wan Kim, Seung-Hyun Lee, Ho-Jin Lee, Jinho Ahn, Hak-Sung Kim (Nano Convergence, (2025), 12, 38)
Conferences · 학회 발표 5
“Study of Reliability of Redistribution Layers in Advanced Packaging: Electrochemical Migration Analysis and Parametric Electrochemical Modeling”, Ho-Jin Lee, Jeong-Hyeon Baek, Tae-Hoon Kim, Ji-Hye Shim, and Hak-Sung Kim (KISM 2025/Poster)
“Study on RDL Reliability in Advanced Semiconductor Packaging Through Copper Migration Analysis and Current Density Optimization”, Ho-Jin Lee, Taek-Hyeon Kim, Jeong-Hyeon Baek, Tae-Hoon Kim, Ji-Hye Shim, and Hak-Sung Kim (대한기계학회 재료 및 파괴부문 춘계학술대회 2025/Oral)
“Effects of Applied Plating Current Density on Electrochemical Reliability of RDL: In-Situ ECM Testing and Lifetime Prediction”, Ho-Jin Lee, Hae-Su Ahn, Ji-Hye Shim, Jun-Hyeong Park, Tae-Hoon Kim, Ju-Yeob Lee, and Hak-Sung Kim (대한기계학회 재료 및 파괴부문 춘계학술대회 2026)
“Effects of Plating Current Density on Electrochemical Reliability of RDL: In-Situ Reliability Testing and Lifetime Prediction”, Ho-Jin Lee, Hae-Su Ahn, Ji-Hye Shim, Jun-Hyeong Park, Tae-Hoon Kim, Ju-Yeob Lee, and Hak-Sung Kim (International Symposium on Microelectronics Packaging 2026)
“Effects of Plating Current Density on Electrochemical Reliability of RDL: In-Situ Electrochemical Migration Testing and Time-to-Failure Prediction”, Ho-Jin Lee, Jeong-Hyeon Baek, Hae-Su Ahn, Tae-Hoon Kim, Ji-Hye Shim, Hyoc-Min Youn, Hakgee Jung, and Hak-Sung Kim (IEEE Electronic Components and Technology Conference 2026/Oral)
Min-Woo Jeon전민우
M.S./Ph.D. Student · 2025.09 – Present
Terahertz inspection for semiconductor processes; TIM thermal test chips
Conferences · 학회 발표 1
“Simultaneous evaluation of battery separator thickness and porosity using band-pass filtered terahertz wave signal” Min-Woo Jeon, Tae-Wan Kim, Sang-Il Kim and Hak-Sung Kim (대한기계학회 재료 및 파괴부문 2026.06 / Oral)
Seung-Won Lee이승원
M.S./Ph.D. Student · 2025.09 – Present
Thermal test chips for thermal interface materials (TIM)
Journal papers · 논문 1
“Development of a Thermal Test Vehicle System for Evaluating the Thermal Behavior of Advanced Semiconductor Packages”, Seung-Won Lee, Gyu-Won Kim, Woong-Kyoo Yoo, and Hak-Sung Kim (Journal of the Microelectronics and Packaging Society)
Conferences · 학회 발표 2
“Development of a Thermal Test Vehicle System for Evaluating the Thermal Behavior and Reliability of Advanced Semiconductor Packages”, Seung-Won Lee, Gyu-Won Kim, Woong-Kyoo Yoo, and Hak-Sung Kim (KMEPS 2026/Oral)
“Development of a Thermal Test Vehicle System for Evaluating the Thermal Behavior and Reliability of Advanced Semiconductor Packages”, Seung-Won Lee, Gyu-Won Kim, Woong-Kyoo Yoo, and Hak-Sung Kim (대한기계학회 재료 및 파괴부문 2026/Oral) 03. “Development of a Thermal Test Vehicle Platform for Thermal Characterization and Reliability Assessment of Advanced Semiconductor Packages”, Seung-Won Lee, Gyu-Won Kim, Woong-Kyoo Yoo, and Hak-Sung Kim (International Symposium on Microelectronics Packaging 2026/Poster)
Hae-Su Ahn안해수
M.S./Ph.D. Student · 2026.03 – Present
Thermal-cycling reliability of multilayer RDL (SAP / dual-SAP)
Conferences · 학회 발표 2
“Comparative Study on Fabrication Quality and Reliability of Multi-Layer RDLs Fabricated by SAP and Dual-SAP”, Hae-Su Ahn, Ho-jin Lee, Ji-Hye Shim, Jun-Hyeong Park, Tae-Hoon Kim, Ju-Yeob Lee, and Hak-Sung Kim (대한기계학회 재료 및 파괴부문 2026/Poster)
“Evaluation of Fabrication Quality and Thermal Cycling Reliability in Multi-Layer RDLs Fabricated by SAP and Dual-SAP”, Hae-Su Ahn, Ho-jin Lee, Ji-Hye Shim, Jun-Hyeong Park, Tae-Hoon Kim, Ju-Yeob Lee, and Hak-Sung Kim (International Symposium on Microelectronics Packaging 2026/Oral)
Jei Jang장제이
M.S./Ph.D. Student · 2026.03 – PresentConferences · 학회 발표 2
“Quantification of Creep Behavior Through Microstructural Analysis of SAC305 Solder”, Jei Jang, You-Kwon Kim, and Hak-Sung Kim (대한기계학회 재료 및 파괴부문 2026/Poster)
“Development of a Modified Creep Constitutive Model Based on Microstructural Evolution for SAC305 Solder”, Jei Jang, You-Gwon Kim, Hak-Sung Kim (International Symposium on Microelectronics Packaging 2026/Poster)
Reliability of automotive power modules (FET) and corrosion
Journal papers · 논문 1
“Corrosion lifetime prediction of electro-galvanized iron using potentiodynamic polarization and multiphysics simulation under different process and environmental conditions”, Se-Jun Park, Ho-Jin Lee, Sang-Il Kim, Kwang-Soon Kim, Jae-Seok Choi, Gab-Seong Lee, and Hak-Sung Kim (Corrosion Science, (2027), 274, 114382)
Conferences · 학회 발표 4
“동전위 분극 시험 및 다중물리 시뮬레이션 기반 아연도금 결정립 크기에 따른 부식 수명 예측”, Se-Jun Park, Ho-Jin Lee, Sang-Il Kim, and Hak-Sung Kim (대한기계학회 재료 및 파괴부문 2025년 춘계학술대회, 2025.06/Oral)
“Effects of EMC Degradation on Viscoelastic Properties and Reliability in Power Semiconductor Packages”, Se-Jun Park, Se-Min Lee, Hee-Ju Han, Hyun-Woo Jung, Kyung-Woo Lee, and Hak-Sung Kim (KISM 2025 BUSAN, 2025.11/Poster)
“공정 및 환경 조건에 따른 동전위 분극 시험과 다중물리 해석을 이용한 전기 아연도금 강판의 부식 수명 예측”, Se-Jun Park, Ho-Jin Lee, Sang-Il Kim, Gwang-Soon Kim, Jae-Seok Choi, and Hak-Sung Kim (2026년도 한국복합재료학회 춘계학술대회, 2026.04/Oral)
“Prediction of Three-Dimensional Temperature Fields Using CFD-Pretrained Deep Neural Networks Enhanced by Transfer Learning”, Se-Jun Park, Young-Min Joo, Jong-Hee Park, and Hak-Sung Kim (대한기계학회 재료 및 파괴부문 2026년 춘계학술대회, 2026.06/Oral)
Hee-Ju Han한희주
M.S. Student · 2025.03 – Present
Signal integrity of degraded RDL interconnects; AI-based thermal-stress prediction for power modules
Conferences · 학회 발표 3
“Impact of Temperature on Signal Integrity in Glass interposers”, Hee-Ju Han, Yun-Joong Kim, Jong-Whi Park and Hak-Sung Kim (대한기계학회 재료 및 파괴부문 2025년 춘계학술대회, 2025.06/Oral)
“Electrical reliability evaluation of Through-Glass Via (TGV) filling using bimodal copper ink”, Hee-Ju Han, Yun-Joong Kim, Se-Min Lee and Hak-Sung Kim (2026년도 한국복합재료학회 춘계학술대회, 2026.04/Oral)
“Analysis of High-Temperature Storage Degradation Behavior in Glass-Substrate-Based CPW Structures with Different Interconnect Geometries”, Hee-Ju Han, Yun-Joong Kim, Hak-Sung Kim (2026년도 한국복합재료학회 춘계학술대회, 2026.04/Oral)
Patents · 특허 1
김학성, 이세민,유웅규,김영우,박종휘,한희주,” 반도체용 기판 및 그 제조 방법”, 국내특허출원, 10-2025-0199590, 2025.12.15.
Yun-Joong Kim김윤중
M.S. Student · 2025.03 – Present
RDL reliability and X-ray metrology of DRAM packages
Journal papers · 논문 1
Young-Min Ju, Hyung-Bin Park, Yun-Joong Kim and Hak-Sung Kim, “Ultrafast Intense Pulsed Light Bonding Process for Multi-die Stacked Packages”, Materials & Design, 2026
Conferences · 학회 발표 3
“Study on Through-Glass Via (TGV) Filling Using Bimodal Copper Ink and Impact on Electrical Reliability”, Yun-Joong Kim, Hee-Ju Han, Se-Min Lee, Jong-Whi Park, Tae-Hoon Kim, Ji-Hye Shim and Hak-Sung Kim (2025년 대한기계학회 재료 및 파괴부문 춘계학술대회, 2025.06/Oral)
“Intense Pulsed Light 및 UV 동시 조사를 통한 Barium Titanate 졸-겔 박막의 초고속 하이브리드 어닐링 및 유전 특성 최적화 연구”, Yun-Joong Kim, Jong-Whi Park, Young-Min Ju and Hak-Sung Kim (2026년도 한국복합재료학회 춘계학술대회, 2026.04/Oral)
“Enhanced Reliability of Bimodal Copper Ink-Filled TGVs via Step-controlled Densification in Glass Interposers”, Yun-Joong Kim, Hee-Ju Han, Yi-Hyun Kim and Hak-Sung Kim (2026년도 한국기계학회 재료 및 파괴부문 춘계학술대회, 2026.06/Oral)
Patents · 특허 2
김학성, 박종휘, 김윤중, “BaTiO3 박막의 유전 특성 향상을 위한 IPL 및 UV 동시 어닐링 공정”, 국내특허출원, 10-2025-0122204, 2025.08.29
김학성, 김윤중, 김이현, 이세민, “전도성 잉크를 이용한 광소결 기반 CMP-less 비아홀 충진 및 치밀화 방법, 국내특허출원, 2026.10
Chae-Young Ahn안채영
M.S. Student · 2025.03 – Present
Thermal interface materials (TIM) and package thermal management
Journal papers · 논문 1
“Anisotropic viscoelastic properties of prepreg and their influence on warpage of thin PCB substrates”, Sanjay Kumar, Woong-Kyoo Yoo, Jaesung Kim, Chae-Young Ahn, Jinwoong Kim, Chan Hyuk Park and Hak-Sung Kim (Composites Part A: Applied Science and Manufacturing)
Conferences · 학회 발표 3
“Optimized Curing Process for Warpage Reduction of Printed Circuit Board Based on Viscoelastic Properties Using a Dielectric Sensor”, Chae-young Ahn, Woong-Kyoo Yoo, and Hak-Sung Kim (대한기계학회 재료 및 파괴부문 2025/Oral)
“Thermal Performance Prediction of Vapor Chamber Integrating an RVE-Based Sintered Wick Permeability Model”, Chae-young Ahn, Gyu-Won Kim, Min-Woo Jeon, Han-byeol Moon, and Hak-Sung Kim (2026 한국반도체디스플레이기술학회/Poster)
“Thermal Performance Prediction of Vapor Chamber Integrating an RVE-Based Sintered Wick Permeability Model”, Chae-young Ahn, Gyu-Won Kim, Min-Woo Jeon, Han-byeol Moon, and Hak-Sung Kim (대한기계학회 재료 및 파괴부문 2026/Oral)
Awards · 수상 1
우수논문상, “Thermal Performance Prediction of Vapor chamber Integrating an RVE-Based Sintered Wick Permeability Model”, 2026 한국반도체디스플레이기술학회, 2026, 05
Jae-Min Youm염재민
M.S. Student · 2025.09 – Present
Advanced package (RDL) reliability
Conferences · 학회 발표 1
“Lock-in Thermography를 사용한 Glass substrate 및 Through-glass via 결함 검사 기술에 관한 연구”, 대한기계학회 재료 및 파괴부문 춘계학술대회, Jun 2026
Patents · 특허 2
LIT를 이용한 하이브리드 본딩 검사 장치 및 방법”, 김학성, 김상일, 김태완, 전민우, 염재민, 김유권, 유동훈, 박형빈 (출원 / 10-2026-0085352, 2026.05.12)
LIT를 이용한 반도체용 기판 구조체 검사 장치 및 방법", 김학성, 김태완, 전민우, 염재민, 이혜은 (출원 / 10-2026-0205268, 2026.10.22)
Na-Young Kim김나영
M.S. Student · 2025.09 – Present
Drop reliability of memory packages and chip fracture strength
Conferences · 학회 발표 1
“Intrinsic critical energy release rate assessment of intermetallic compound in Cu/SAC 305 solder joint using Fully-IMC specimen” Na-Young Kim, Dong-Hoon Yoo, Jea-Yeon Ra, Ji-Hyung Lee, Min-Seok Kwak and Hak-Sung Kim (대한기계학회 재료 및 파괴부문 2026.06 / Oral)
Hye-Eun Lee이혜은
M.S. Student · 2026.03 – PresentConferences · 학회 발표 1
“Optimization of Thermo-Compression Bonding Process and Reliability test of Self-assembly Anisotropic Conductive Adhesive for Fine Pitch Ineterconnections” Hye-Eun Lee, Tae-Wan Kim, Hyeong-Bin Park, Jin-Woo Huh, Seol Kim, Chang-Hoon Sim, Kyung-Sub Lee and Hak-Sung Kim (대한기계학회 재료 및 파괴부문 2026.06 / Poster)
Patents · 특허 1
김학성, 김태완, 전민우, 염재민, 이혜은, “LIT를 이용한 반도체용 기판 구조체 검사 장치 및 방법”, 국내특허출원, 10-2026-0205268, 2026.10.22
Yi-Hyun Kim김이현
M.S. Student · 2026.09 – Present
Thermal-cycling reliability of multilayer RDL
Patents · 특허 1
“전도성 잉크를 이용한 광소결 기반 CMP-Less비아홀 충진 및 치밀화 방법” 김윤중, 김이현, 이세민, 김학성 (출원)
Joo-Hyun Sim심주현
M.S. Student · 2026.09 – Present
Drop reliability of memory packages
Research Interns · 학부연구생 5
Min-Hyeok Jeon전민혁
Research Intern
Do-Hyeon Kim김도현
Research Intern
Drop reliability simulation and package thermal management
Gyu-Bin Kim김규빈
Research Intern
Thermal test chips for thermal interface materials (TIM)
Jae-Hyun Koo구재현
Research Intern
Lock-in thermography and terahertz spectroscopy for inspection
Do-Hyeon Lee이도현
Research Intern
Staff · 행정 및 센터 2
Kang-Hee Kim김강희
Research Administrator
Seok-Hyeong Song송석형
Advanced Semiconductor Packaging Center Manager
Alumni · 졸업생 40
이름, 학위, 연구실 재학 기간, 진로는 예전 연구실 홈페이지 데이터베이스(hy_members) 기준입니다.
Ph.D. · 박사 22
Jeong-Beom Nam남정범Ph.D.
LG Electronics
Sang-Il Kim김상일Ph.D. · 2020–2026
SK hynix
Terahertz non-destructive monitoring of thin-film manufacturing processes · Ph.D. Dissertation Excellence Award
Young-Min Ju주영민Ph.D. · 2020–
Samsung Electronics Co., Ltd.
IPL flip-chip bonding; WBG die-attach
Jeong-Hyeon Baek백정현Ph.D. · 2020–2026
Samsung Electronics Co., Ltd.
EMC cure modeling and warpage prediction; RDL and TGV reliability
Heon-Su Kim김헌수Ph.D. · 2019–
Samsung Electronics Co., Ltd.
Hui-Jin Um엄희진Ph.D. · 2018–
Hanwha Aerospace
Design and analysis of fiber reinforced composites; Semiconductor Packaging reliability
Jong-Whi Park박종휘Ph.D. → Postdoc · 2018–2024
Samsung Electronics Co., Ltd.
Dong-Woon Park박동운Ph.D. program · 2017–
Samsung Electronics Co., Ltd.
Myeong-Hyeon YuPh.D. program · 2016–
Samsung Electronics Co., Ltd.
Yong-Rae Jang장용래Ph.D. → Postdoc · 2016–
University of Maryland, College Park (Postdoc)
Dug-Joong Kim김덕중Ph.D. program · 2016–
Samsung Electronics Co., Ltd.
Dong-Hyun Kim김동현Ph.D. program · 2015–
KAERI(Korea Atomic Energy Research Institute)
Gyung-Hwan Oh오경환Ph.D. · 2015–
Samsung Electronics Co., Ltd.
Yeon-Taek Hwang황연택Ph.D. → Postdoc · 2014–
SK hynix
Micromechanics analysis of fiber reinforced composite; Reliability analysis of semiconductor PKG
Chang-Jin Moon문창진Ph.D. program · 2016–
SEMES Co., Ltd
IPL annealing of TFT materials
Sung-Jun Joo주성준Ph.D. · 2013–
Samsung Electronics Co., Ltd.
Reliability analysis of multi-layer PCB; Flash light sintering of Cu/Ag nano-ink
Chung-Hyeon Ryu류충현Ph.D. → Postdoc · 2015–
Samsung Electro-Mechanics Co., Ltd.
Non-destructive evaluation using THz Nanoink fabrication for printed -electronics Flash light sintering
Corrosion lifetime prediction of electro-galvanized iron using potentiodynamic polarization and multiphysics simulation under different process and environmental conditionsPark S.-J., Lee H.-J., Kim S.-I., Kim K.-S., Choi J.-S., Lee G.-S., Kim H.-S. · Corrosion Science, 274, 114382 (2027) · DOI ↗
Ultra-millisecond flip-chip bonding process via intense pulsed light irradiationJu Y.-M., Ryu S.-U., Park J.-W., Kim H.-S. · ACS Applied Materials & Interfaces, 17(27), 39694–39707 (2025)
Process-integrated in-situ characterization and multiscale modeling of cure-dependent thermo-mechanical behavior of epoxy molding compounds for accurate warpage prediction in advanced semiconductor packagingBaek J.-H., Yoo W.-K., An W.-J., Song J.-S., Oh G.-H., Shim J.-H., Kim H.-S. · Materials Today Advances, 30, 100781 (2026)
Integrated electrochemical characterization and finite element modeling for optimizing copper filling in through-glass viasKim Y.-W., Baek J.-H., Lee S.-M., Park J.-W., Lee H.-J., Kim T.-H., Shim J.-H., So H.-Y., Kim H.-S. · Journal of Electroanalytical Chemistry, 1017, 120313 (2026)
In-situ non-contact monitoring of photoresist thickness and degree of cure using terahertz time-domain spectroscopyKim S.-I., Kim H.-S. · NDT and E International, 157, 103530 (2026)
Effect of electroplating current density and post-annealing on the warpage and reliability of redistribution layer for advanced semiconductor packageKim T.-H., Baek J.-H., Kim S.-I., Kim T.-H., Shim J.-H., Kim H.-S. · Materials and Design, 259, 114732 (2025)
Prediction of fatigue life of semiconductor package under thermal cycling: combined effect of package design and solder materialsKim H.-S., Kim Y.-G., Jang D.-M., Jang J.-W., Lee S.-Y., Kim H.-S. · Materials and Design, 254, 114059 (2025)
Advanced WBG power semiconductor packaging: nanomaterials and nanotechnologies for high-performance die attach pasteJu Y.-M., Kim T.-W., Lee S.-H., Lee H.-J., Ahn J., Kim H.-S. · Nano Convergence, 12(1), 38 (2025)
Most cited
Intense pulsed light sintering of copper nanoink for printed electronicsKim H.-S., Dhage S.R., Shim D.-E., Hahn H.T. · Applied Physics A, 97(4), 791–798 (2009)
Reactive sintering of copper nanoparticles using intense pulsed light for printed electronicsRyu J., Kim H.-S., Hahn H.T. · Journal of Electronic Materials, 40(1), 42–50 (2011)
Inkjet printed electronics using copper nanoparticle inkKang J.S., Kim H.-S., Ryu J., Hahn H.T., Jang S., Joung J.W. · Journal of Materials Science: Materials in Electronics, 21(11), 1213–1220 (2010)
Patents
254 patent applications (138 inventions), 98 registered in Korea, the U.S., Europe (EP, UK, DE, FR) and China; 16 applications co-filed with industry in 2022–2026.
Low-power, ultrafast micro-bump bonding process using intense pulsed lightKR · 2025
Zero-warpage packaging method using a top–bottom symmetric structureKR · 2025
Anisotropic conductive film for damage-free micro bump testKR · 2026
Apparatus and method for semiconductor packaging process monitoring using terahertz wavesKR · 2024
Apparatus and method for plasma process monitoring using terahertz wavesKR, US · 2024
News & Talks · 소식
News & talks
한양대학교 APIL 연구실의 소식을 보실 수 있습니다.
APIL 올해의 비파괴 검사기술 선정 — 김학성 교수 연구팀(김태완·전민우 연구원)이 개발한 ‘테라헤르츠 전자기파를 이용한 실시간 비접촉 반도체 공정 검사’ 기술이 한국비파괴검사학회(KSNT)가 선정하는 ‘2026 대한민국 올해의 비파괴검사기술’로 뽑혀, 2026년 10월 29일 학회로부터 상패를 받았습니다. 갤러리에서 보기 →2026 대한민국 올해의 비파괴검사기술 상패한국비파괴검사학회 시상식 — 상패 수여한국비파괴검사학회 시상식
Corrosion Science 논문 게재 — 공정·환경 조건을 고려한 전기아연도금강판 부식 수명 예측 박세준 석사과정(제1저자), 이호진 석박사통합과정, 김상일 박사가 삼성전자 글로벌기술연구소와 함께 수행한 연구가 부식 분야 국제학술지 Corrosion Science(Vol. 274, 2027)에 게재되었습니다. 연구팀은 도금 전류밀도로 전기아연도금강판(EGI)의 결정립 크기(34.8–38.0 nm)를 제어하고, 동전위 분극(PDP) 시험에서 얻은 전기화학 인자를 혼합전위 이론 기반 다중물리 유한요소(FEM) 부식 모델에 반영했습니다. 여기에 NaCl 농도·온도·pH별 가속 인자를 결합해 공정과 사용 환경에 따른 아연 도금층의 부식 수명을 예측했으며, ASTM B117 기반 염수분무시험의 무게 감소 결과와 약 90–96% 일치함을 확인했습니다. 가전제품용 강판처럼 고온·고습·세제 환경에 노출되는 부품의 장기 신뢰성 설계에 활용될 수 있습니다. 논문 보기 ↗전기아연도금강판(EGI)의 부식 개시 및 보호 메커니즘염수분무시험(SST) 후 표면 변화와 무게 감소공정·환경 조건에 따른 부식 수명 예측 맵
Prof. Hak-Sung Kim receives the QNEX Academic Award from the Korean Society for Nondestructive Testing.
Prof. Hak-Sung Kim gives the packaging tutorial “Advanced Semiconductor Packaging Technology: Overview” at SEMICON Korea 2026 (SEMI University, COEX, Seoul).
Dr. Sang-Il Kim receives Hanyang University’s Ph.D. Dissertation Excellence Award; two APIL Ph.D. students graduate.
APIL team receives the Excellent Paper Presentation Award from the Korean Society for Nondestructive Testing.
An APIL student receives the 20th Semiconductor Scholarship.
APIL’s terahertz chip-alignment inspection paper wins the 35th Science & Technology Excellent Paper Award (KOFST).
Best Paper Award, Journal of the Korean Society for Nondestructive Testing (2024 volume).
Prof. Hak-Sung Kim receives the Haedong Young Engineer Award from the Korea Microelectronics and Packaging Society.
Prof. Kim appointed Technical Advisory Professor at Samsung Electronics and Visiting Professional Partner at SK hynix.
Invited talk: “Milli-Seconds Multi Flip-Chip Bonding Process via Intense Pulsed Light Irradiation for Advanced Semiconductor Packaging,” Honolulu, HI, USA.
Keynote at TestConX Korea 2025, Seoul.
Ultra-millisecond IPL flip-chip bonding published in ACS Applied Materials & Interfaces.
Keynote at The Elec Semiconductor Packaging Conference, COEX, Seoul (also Apr. 2024).
Prof. Kim named among Elsevier’s Top 2% Scientists.
Gallery · 갤러리
Lab life & events
APIL 연구실의 행사, 학회, 수상·소식을 160개 행사별로 정리했습니다(사진 209장). 위 탭에서 종류를 고르고, 아래 연도 버튼으로 기간을 좁혀 볼 수 있습니다.
